Abstract: A memory device includes an alternating stack of insulating layers and electrically conductive layers arranged along a vertical direction, a memory opening vertically extending through the alternating stack, and a memory opening fill structure located in the memory opening and including a vertical semiconductor channel and a memory film. The memory film includes a blocking dielectric film, a tunneling dielectric layer and a vertical stack of memory elements located between the blocking dielectric film and the tunneling dielectric layer. The blocking dielectric film includes component layers which include, from a side that is proximal to the vertical stack of memory elements toward a side that is distal from the vertical stack of memory elements, an inner silicon oxide blocking dielectric layer, a middle dielectric metal oxide blocking dielectric layer, an outer silicon oxide blocking dielectric layer, and an outer dielectric metal oxide blocking dielectric layer.

Abstract: A method of forming a memory device includes forming an alternating stack of disposable material layers and silicon nitride layers over a substrate, forming a memory opening through the alternating stack, forming a memory film in the memory opening, forming a vertical semiconductor channel over the memory film in the memory opening, forming a backside trench through the alternating stack, forming laterally-extending cavities by removing the disposable material layers selective to the silicon nitride layers through the backside trench, oxidizing portions of the silicon nitride layers exposed in the laterally-extending cavities to form insulating layers, and replacing remaining portions of the silicon nitride layers with electrically conductive layers.

Abstract: A memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, a memory opening vertically extending through the alternating stack, and a memory opening fill structure located in the memory opening. The memory opening fill structure includes a memory film and a vertical semiconductor channel. The memory film includes a tunneling dielectric layer, a charge storage layer that laterally surrounds the tunneling dielectric layer, a dielectric metal oxide blocking dielectric layer that laterally surrounds the charge storage layer and contacts the vertical semiconductor channel, and a silicon oxide blocking dielectric layer that laterally surrounds the dielectric metal oxide blocking dielectric layer and contacts the vertical semiconductor channel.