Patents by Inventor Noriyuki Ousaka

Noriyuki Ousaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5698385
    Abstract: The silver halide photosensitive material of the invention comprises a support, at least one photosensitive silver halide emulsion layer provided on the support and a protective layer provided on the photosensitive silver halide emulsion layer. The protective layer contains agglomerate particles each of which is formed from plural primary particles having a particle diameter smaller than the thickness of the protective layer. For example, agglomerate particles having a mean particle diameter of 0.2 to 30 .mu.m composed of primary particles having a mean particle diameter of 0.01 to 10 .mu.m are contained in the protective layer having a thickness of 0.1 to 10 .mu.m. By the use of such agglomerate particles as matting agent particles, pin-holes caused by sinking of the matting agent can be inhibited and the Bekk second can be made not longer than 2,000 seconds. Moreover, this matting agent has good affinity for gelatin and is almost free from powder-dropping.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: December 16, 1997
    Assignees: Soken Chemical & Engineering Co., Ltd., Fuji Photo Film Co., Ltd.
    Inventors: Noriyuki Ousaka, Yasuhiro Okada, Satoshi Kanetake, Kunio Ishigaki
  • Patent number: 5162087
    Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.
    Type: Grant
    Filed: August 30, 1991
    Date of Patent: November 10, 1992
    Assignees: Soken Chemical & Engineering Co., Ltd., Chemitech Corporation
    Inventors: Hidemoto Fukuzawa, Tatsuhiro Imai, Yasuhiro Okada, Noriyuki Ousaka