Abstract: Multiple cutting blades (56) are fabricated from a wafer (130). This wafer (130) is disposed on a blade handle mounting fixture (224) such that a blade handle (24) maybe mounted on each of the individual blades (56). A cutting edge (80) of each blade (56) is maintained in spaced relation to the fixture (224) as these blade handles (24) are being mounted. Thereafter, the wafer (130) is transferred to a blade separation fixture (300). Each blade 56 is suspended above the fixture (300). An appropriate force is transmitted to the individual blades (56) to separate the same from the wafer (130). Separation preferably occurs before the blade (56) contacts the fixture (300). Thereafter, the blade (56) in effect pivots into an inclined position where its cutting edge (80) projects at least generally upwardly. Preferably, at no time does the cutting edge (80) of any blade (56) contact either the blade handle mounting fixture (224) or the blade separation fixture (300).

Abstract: A blade separation fixture (300) is disclosed. A wafer (130) is positioned on the fixture (300). This wafer (130) includes a plurality of cutting blades (56) that are initially spaced above the fixture (300). Blade handles (24) will typically already have been mounted on each of the various cutting blades (56) at this time. In any case, each of the various cutting blades (56) are separated from the wafer (130) by applying an appropriate downwardly directed force. Separated blades (56) in effect pivot into an inclined position against the fixture (300) without having their corresponding cutting edges (80) contact the fixture (300).

Abstract: A cutting tool (20) for a microkeratome (4) is disclosed. This cutting tool (20) includes a blade handle (24) and a separate cutting blade (56). Both the blade handle (24) and cutting blade (56) include features to register or align a cutting edge (80) of the cutting blade (56) with a microkeratome registration surface (28) of the blade handle (24). This microkeratome registration surface (28) of the blade handle (24) interfaces with a cutting tool registration surface (14) of a head assembly (10) of the microkeratome (4) on which the cutting tool (20) is installed. Therefore, the cutting edge (80) of the cutting blade (56) is registered or aligned relative to the cutting tool registration surface (14) of the head assembly (10) of the microkeratome (4).

Abstract: A microkeratome blade (54) that that is fabricated from a wafer (130) is disclosed. The blade (54) includes a notch (110) on its rear surface (106). During fabrication of the blade (54) from the wafer (130), a blade support tab (131) provides a structural interconnection between the wafer (130) and the blade (56). This blade support tab (131) extends within the notch (110) and merges with the blade (56). A score (132) extends across at least part of the blade support tab (131) to facilitate separation of the blade (56) from the wafer (130) by fracturing or the like. This score (132) is positioned such that the surface defined by separating the blade (56) from the wafer (130) at least generally along the score (132) is “disposed within” the notch (110) or recessed relative to a rearwardmost portion of the rear surface (106) of the blade (56).

Abstract: A method for providing a cutting tool (20) is disclosed. Multiple cutting blades (56) are fabricated from a wafer (130). This wafer (130) is disposed on a blade handle mounting fixture (224) such that a blade handle (24) may be mounted on each of the individual blades (56). A cutting edge (80) of each blade (56) is maintained in spaced relation to the fixture (224) as these blade handles (24) are being mounted. Thereafter, the wafer (130) is transferred to a blade separation fixture (300). Each blade 56 is suspended above the fixture (300). An appropriate force is transmitted to the individual blades (56) to separate the same from the wafer (130). Separation preferably occurs before the blade (56) contacts the fixture (300). Thereafter, the blade (56) in effect pivots into an inclined position where its cutting edge (80) project at least generally upwardly.

Abstract: Various methods relating to one or more registration features (94) associated with a cutting blade (56) are disclosed. A masking layer (118) is formed on a wafer (130) and is patterned to define a plurality of mask apertures (122a-c). An anisotropic etch simultaneously forms a first cutting edge surface (72) and at least one registration surface (94) for the blade (56) via the mask apertures 122a and 122b, respectively. The anisotropic etch stops at the same crystallographic plane for both the first cutting edge surface (72) and the registration surface(s) (94). This may be used to accurately register a cutting edge (80) of the blade (56) relative to one or more structures that may be associated with the blade (56).

Abstract: A method for fabricating a cutting blade (56) from a wafer (130) is disclosed. The wafer (130) is etched to define part of the perimeter of the blade (56). This etch also defines a blade support (131) that maintains a structural interconnection between the blade (56) and the wafer (130). A score (132) is formed across at least part of the blade support tab (131). Fracturing the blade support tab (131) at least generally along the score (132) at some point in time after the completion of the etch facilitates the separation of the blade (56) from the wafer (130).

Abstract: A blade handle mounting fixture (224) is disclosed. A wafer (130) is positioned on the fixture (224). This wafer (130) includes a plurality of cutting blades (56). Blade handles (24) may be mounted on each of the various cutting blades (56) while the wafer (130) is positioned on the fixture (224). Thereafter, the wafer (130) may be removed and transferred to a blade separation fixture (300). Here the blades (56), with handles (24) having been previously mounted thereon, are separated from the wafer (130).