Patents by Inventor Norman Lee Owens

Norman Lee Owens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10134660
    Abstract: A semiconductor device includes a lead frame site including a die attach region and corrugated metal leads around the die attach region. Each of the corrugated metal leads includes two or more corrugations. Each of the two or more corrugations includes a first flat horizontal portion, a first vertical portion with a first end directly adjacent and connected to a first end of the first flat horizontal portion, a second flat horizontal portion with a first end directly adjacent and connected to a second end of the first vertical portion, and a second vertical portion with a first end directly adjacent and connected to a second end of the second flat horizontal portion. The first flat horizontal portion is in a different plane than the second flat horizontal portion.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: November 20, 2018
    Assignee: NXP USA, Inc.
    Inventors: Jinbang Tang, Aruna Manoharan, Norman Lee Owens, Gary Carl Johnson
  • Publication number: 20180277464
    Abstract: A semiconductor device includes a lead frame site including a die attach region and corrugated metal leads around the die attach region. Each of the corrugated metal leads includes two or more corrugations. Each of the two or more corrugations includes a first flat horizontal portion, a first vertical portion with a first end directly adjacent and connected to a first end of the first flat horizontal portion, a second flat horizontal portion with a first end directly adjacent and connected to a second end of the first vertical portion, and a second vertical portion with a first end directly adjacent and connected to a second end of the second flat horizontal portion. The first flat horizontal portion is in a different plane than the second flat horizontal portion.
    Type: Application
    Filed: March 23, 2017
    Publication date: September 27, 2018
    Inventors: JINBANG TANG, Aruna Manoharan, Norman Lee Owens, Gary Carl Johnson
  • Publication number: 20080289867
    Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
    Type: Application
    Filed: June 2, 2008
    Publication date: November 27, 2008
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventor: NORMAN LEE OWENS
  • Patent number: 7397001
    Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: July 8, 2008
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Norman Lee Owen
  • Patent number: 7199306
    Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: April 3, 2007
    Assignee: Freescale Semiconductor, Inc.
    Inventor: Norman Lee Owens
  • Publication number: 20040129452
    Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
    Type: Application
    Filed: December 19, 2003
    Publication date: July 8, 2004
    Inventor: Norman Lee Owens
  • Patent number: 6710265
    Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: March 23, 2004
    Assignee: Motorola, Inc.
    Inventor: Norman Lee Owens
  • Publication number: 20030027377
    Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
    Type: Application
    Filed: September 26, 2002
    Publication date: February 6, 2003
    Inventor: Norman Lee Owens
  • Patent number: 6465743
    Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
    Type: Grant
    Filed: December 5, 1994
    Date of Patent: October 15, 2002
    Assignee: Motorola, Inc.
    Inventor: Norman Lee Owens