Abstract: A low profile inker for use in a semiconductor testing apparatus. A probe test head of the apparatus detects defective circuits on a semiconductor wafer and generates control signals in response thereto. The inker is connected to the testing apparatus by means of a support arm beneath the probe test head. An inker reservoir is connected to the support arm and has a substantially vertical needle extending therefrom with a tip thereof proximate the semiconductor wafer circuit under test. A solenoid activated plunger arm is connected to the support arm in parallel with the reservoir and an angle pin connects the plunger to an inker filament disposed within the reservoir. The angle pin converts vertical movement of the solenoid operated plunger into parallel movement of the inker filament within the reservoir for forcing liquid onto the semiconductor wafer in order to mark defective circuits.