Abstract: A device for enabling testing electrical paths through an area array package of a circuit assembly is presented. The device may include a measurement access target on the area array package, wherein the measurement access target is connected to fill metal in the signal routing layers of the area array package. A method for testing continuity of electrical paths through an area array package of a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated; a test probe is coupled to a measurement access target on the area array, where the measurement access target is connected to fill metal in the signal routing layers of the area array package; and an electrical characteristic is measured by a tester coupled to the test probe to determine continuity of electrical paths through the area array of the circuit assembly.

Abstract: A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace configuration alleviates routing congestion in an IC package and permits an IC to accommodate a greater number of channels within a given surface area than is possible under the prior art.

Abstract: In a method for testing continuity of electrical paths through a connector, pairs of contacts of the connector are coupled via a first plurality of passive circuit components. The contacts are also coupled to a test sensor port via a second plurality of passive circuit components, ones of which are coupled in parallel to the test sensor port. The method proceeds with stimulating one or more nodes of the connector, and then measuring an electrical characteristic via the test sensor port. Finally, the measured electrical characteristic is compared to at least one threshold to assess continuities of at least two electrical paths through the connector.