Patents by Inventor Nuwan S. Jayasena

Nuwan S. Jayasena has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170255397
    Abstract: Systems, apparatuses, and methods for implementing efficient queues and other data structures. A queue may be shared among multiple processors and/or threads without using explicit software atomic instructions to coordinate access to the queue. System software may allocate an atomic queue and corresponding queue metadata in system memory and return, to the requesting thread, a handle referencing the queue metadata. Any number of threads may utilize the handle for accessing the atomic queue. The logic for ensuring the atomicity of accesses to the atomic queue may reside in a management unit in the memory controller coupled to the memory where the atomic queue is allocated.
    Type: Application
    Filed: March 7, 2016
    Publication date: September 7, 2017
    Inventors: Nuwan S. Jayasena, Dong Ping Zhang, Paula Aguilera Diez
  • Publication number: 20170228164
    Abstract: Systems and methods for efficiently processing data in a non-uniform memory access (NUMA) computing system are disclosed. A computing system includes multiple nodes connected in a NUMA configuration. Each node includes a processing unit which includes one or more processors. A processor in a processing unit executes an instruction that identifies an address corresponding to a data location. The processor determines whether a memory device stores data corresponding to the address. A response is returned to the processor. The response indicates whether the memory device stores data corresponding to the address. The processor completes processing of the instruction without retrieving the data.
    Type: Application
    Filed: February 10, 2016
    Publication date: August 10, 2017
    Inventors: Nuwan S. Jayasena, Dong Ping Zhang, Kevin McGrath
  • Patent number: 9720487
    Abstract: Durations of power management states are predicted on a per-process basis. Some embodiments include storing, in one or more data structures associated with one or more processes, information indicating previous durations of a power management state associated with the process(es). Some embodiments also include predicting a subsequent duration of the power management state for the process(es) using information stored in the data structure(s).
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: August 1, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: William L. Bircher, Madhu Saravana Sibi Govindan, Manish Arora, Michael J. Schulte, Nuwan S. Jayasena
  • Publication number: 20170212851
    Abstract: The described embodiments include a computing device with multiple interrupt processors for processing interrupts. In the described embodiments, each of the multiple processors is classified as one or more processor types based on factors such as features and functionality of the processor, an operating environment of the processor, the characteristics of some or all of the available interrupts, etc. During operation, an interrupt controller in the computing device receives an indication of an interrupt. The interrupt controller then determines a processor type for processing the interrupt. Next, the interrupt controller causes the interrupt to be processed by one of the plurality of processors that is the determined processor type.
    Type: Application
    Filed: January 25, 2016
    Publication date: July 27, 2017
    Inventors: Nuwan S. Jayasena, Andrew G. Kegel
  • Publication number: 20170200672
    Abstract: The described embodiments include an interposer with signal routes located therein. The interposer includes a set of sites arranged in a pattern, each site including a set of connection points. Each connection point in each site is coupled to a corresponding one of the signal routes. Integrated circuit chiplets may be mounted on the sites and signal connectors for mounted integrated circuit chiplets may coupled to some or all of the connection points for corresponding sites, thereby coupling the chiplets to corresponding signal routes. The chiplets may then send and receive signals via the connection points and signal routes. In some embodiments, the set of connection points in each of the sites is the same, i.e., has a same physical layout. In other embodiments, the set of connection points for each site is arranged in one of two or more physical layouts.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 13, 2017
    Inventors: Nuwan S. Jayasena, David A. Roberts
  • Publication number: 20170160955
    Abstract: A die-stacked hybrid memory device implements a first set of one or more memory dies implementing first memory cell circuitry of a first memory architecture type and a second set of one or more memory dies implementing second memory cell circuitry of a second memory architecture type different than the first memory architecture type. The die-stacked hybrid memory device further includes a set of one or more logic dies electrically coupled to the first and second sets of one or more memory dies, the set of one or more logic dies comprising a memory interface and a page migration manager, the memory interface coupleable to a device external to the die-stacked hybrid memory device, and the page migration manager to transfer memory pages between the first set of one or more memory dies and the second set of one or more memory dies.
    Type: Application
    Filed: November 16, 2016
    Publication date: June 8, 2017
    Inventors: Nuwan S. Jayasena, Gabriel H. Loh, James M. O'Connor, Niladrish Chatterjee
  • Publication number: 20170139635
    Abstract: A processing system includes a plurality of processor cores formed in a first layer of an integrated circuit device and a plurality of partitions of memory formed in one or more second layers of the integrated circuit device. The one or more second layers are deployed in a stacked configuration with the first layer. Each of the partitions is associated with a subset of the processor cores that have overlapping footprints with the partitions. The processing system also includes first memory paths between the processor cores and their corresponding subsets of partitions. The processing system further includes second memory paths between the processor cores and the partitions.
    Type: Application
    Filed: November 17, 2015
    Publication date: May 18, 2017
    Inventors: Nuwan S. Jayasena, Yasuko Eckert
  • Patent number: 9535831
    Abstract: A die-stacked hybrid memory device implements a first set of one or more memory dies implementing first memory cell circuitry of a first memory architecture type and a second set of one or more memory dies implementing second memory cell circuitry of a second memory architecture type different than the first memory architecture type. The die-stacked hybrid memory device further includes a set of one or more logic dies electrically coupled to the first and second sets of one or more memory dies, the set of one or more logic dies comprising a memory interface and a page migration manager, the memory interface coupleable to a device external to the die-stacked hybrid memory device, and the page migration manager to transfer memory pages between the first set of one or more memory dies and the second set of one or more memory dies.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: January 3, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Nuwan S. Jayasena, Gabriel H. Loh, James M. O'Connor, Niladrish Chatterjee
  • Patent number: 9489321
    Abstract: A memory accessing agent includes a memory access generating circuit and a memory controller. The memory access generating circuit is adapted to generate multiple memory accesses in a first ordered arrangement. The memory controller is coupled to the memory access generating circuit and has an output port, for providing the multiple memory accesses to the output port in a second ordered arrangement based on the memory accesses and characteristics of an external memory. The memory controller determines the second ordered arrangement by calculating an efficient row burst value and interrupting multiple row-hit requests to schedule a row-miss request based on the efficient row burst value.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: November 8, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: James M. O'Connor, Niladrish Chatterjee, Nuwan S. Jayasena, Gabriel H. Loh
  • Patent number: 9471130
    Abstract: The described embodiments include a computing device with an entity (a processor, a processor core, etc.) and a controller. In these embodiments, the controller, using an idle duration history, predicts a duration of a next idle period for the entity. Based on the predicted duration of the next idle period, the controller configures the entity to operate in a corresponding idle state.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: October 18, 2016
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Manish Arora, Nuwan S. Jayasena, Michael J. Schulte
  • Patent number: 9442557
    Abstract: The described embodiments include a computing device with one or more entities (processor cores, processors, etc.). In some embodiments, during operation, a thermal power management unit in the computing device uses a linear prediction to compute a predicted duration of a next idle period for an entity based on the duration of one or more previous idle periods for the entity. Based on the predicted duration of the next idle period, the thermal power management unit configures the entity to operate in a corresponding idle state.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: September 13, 2016
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Manish Arora, Nuwan S. Jayasena, Yasuko Eckert, Madhu Saravana Sibi Govindan, William L. Bircher, Michael J. Schulte, Srilatha Manne
  • Publication number: 20160246715
    Abstract: A memory module is responsive to control signaling for a random access memory (RAM) module, and performs translation of received memory addresses so that it can map a relatively small address space of an operating system to a larger physical address space of its storage arrays. The memory module can therefore be employed in systems requiring a large amount of memory, such as systems using many processors, without requiring specialized operating systems for addressing the larger physical address space.
    Type: Application
    Filed: February 23, 2015
    Publication date: August 25, 2016
    Inventors: Michael Ignatowski, Gabriel H. Loh, Nuwan S. Jayasena
  • Publication number: 20160232097
    Abstract: An integrated circuit (IC) package includes a stacked-die memory device. The stacked-die memory device includes a set of one or more stacked memory dies implementing memory cell circuitry. The stacked-die memory device further includes a set of one or more logic dies electrically coupled to the memory cell circuitry. The set of one or more logic dies includes a query controller and a memory controller. The memory controller is coupleable to at least one device external to the stacked-die memory device. The query controller is to perform a query operation on data stored in the memory cell circuitry responsive to a query command received from the external device.
    Type: Application
    Filed: February 5, 2016
    Publication date: August 11, 2016
    Inventors: Gabriel H. Loh, Nuwan S. Jayasena, James M. O'Connor, Yasuko Eckert
  • Patent number: 9344091
    Abstract: A die-stacked memory device incorporates a reconfigurable logic device to provide implementation flexibility in performing various data manipulation operations and other memory operations that use data stored in the die-stacked memory device or that result in data that is to be stored in the die-stacked memory device. One or more configuration files representing corresponding logic configurations for the reconfigurable logic device can be stored in a configuration store at the die-stacked memory device, and a configuration controller can program a reconfigurable logic fabric of the reconfigurable logic device using a selected one of the configuration files. Due to the integration of the logic dies and the memory dies, the reconfigurable logic device can perform various data manipulation operations with higher bandwidth and lower latency and power consumption compared to devices external to the die-stacked memory device.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: May 17, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Nuwan S. Jayasena, Michael J. Schulte, Gabriel H. Loh, Michael Ignatowski
  • Publication number: 20160124873
    Abstract: An integrated circuit device includes a memory controller coupleable to a memory. The memory controller to schedule memory accesses to regions of the memory based on memory timing parameters specific to the regions. A method includes receiving a memory access request at a memory device. The method further includes accessing, from a timing data store of the memory device, data representing a memory timing parameter specific to a region of the memory cell circuitry targeted by the memory access request. The method also includes scheduling, at the memory controller, the memory access request based on the data.
    Type: Application
    Filed: May 16, 2013
    Publication date: May 5, 2016
    Inventors: Yi Xu, Nuwan S. Jayasena, Yuan Xie
  • Patent number: 9286948
    Abstract: An integrated circuit (IC) package includes a stacked-die memory device. The stacked-die memory device includes a set of one or more stacked memory dies implementing memory cell circuitry. The stacked-die memory device further includes a set of one or more logic dies electrically coupled to the memory cell circuitry. The set of one or more logic dies includes a query controller and a memory controller. The memory controller is coupleable to at least one device external to the stacked-die memory device. The query controller is to perform a query operation on data stored in the memory cell circuitry responsive to a query command received from the external device.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: March 15, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Gabriel H. Loh, Nuwan S. Jayasena, James M. O'Connor, Yasuko Eckert
  • Publication number: 20160048327
    Abstract: A system and method are disclosed for managing memory interleaving patterns in a system with multiple memory devices. The system includes a processor configured to access multiple memory devices. The method includes receiving a first plurality of data blocks, and then storing the first plurality of data blocks using an interleaving pattern in which successive blocks of the first plurality of data blocks are stored in each of the memory devices. The method also includes receiving a second plurality of data blocks, and then storing successive blocks of the second plurality of data blocks in a first memory device of the multiple memory devices.
    Type: Application
    Filed: August 14, 2014
    Publication date: February 18, 2016
    Inventors: Nuwan S. Jayasena, Lisa R. Hsu, James M. O'Connor
  • Patent number: 9251069
    Abstract: A system and method for efficiently limiting storage space for data with particular properties in a cache memory. A computing system includes a cache array and a corresponding cache controller. The cache array includes multiple banks, wherein a first bank is powered down. In response a write request to a second bank for data indicated to be stored in the powered down first bank, the cache controller determines a respective bypass condition for the data. If the bypass condition exceeds a threshold, then the cache controller invalidates any copy of the data stored in the second bank. If the bypass condition does not exceed the threshold, then the cache controller stores the data with a clean state in the second bank. The cache controller writes the data in a lower-level memory for both cases.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: February 2, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Yasuko Eckert, Gabriel H. Loh, Mauricio Breternitz, James M. O'Connor, Srilatha Manne, Nuwan S. Jayasena, Mithuna S. Thottethodi
  • Patent number: 9244629
    Abstract: Methods, systems and computer readable storage mediums for more efficient and flexible scheduling of tasks on an asymmetric processing system having at least one host processor and one or more slave processors, are disclosed. An example embodiment includes, determining a data access requirement of a task, comparing the data access requirement to respective local memories of the one or more slave processors selecting a slave processor from the one or more slave processors based upon the comparing, and running the task on the selected slave processor.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: January 26, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Lisa R. Hsu, Gabriel H. Loh, James Michael O'Connor, Nuwan S. Jayasena
  • Patent number: 9235528
    Abstract: A system, method, and memory device embodying some aspects of the present invention for remapping external memory addresses and internal memory locations in stacked memory are provided. The stacked memory includes one or more memory layers configured to store data. The stacked memory also includes a logic layer connected to the memory layer. The logic layer has an Input/Output (I/O) port configured to receive read and write commands from external devices, a memory map configured to maintain an association between external memory addresses and internal memory locations, and a controller coupled to the I/O port, memory map, and memory layers, configured to store data received from external devices to internal memory locations.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: January 12, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Lisa R. Hsu, Gabriel H. Loh, Michael Ignatowski, Michael J. Schulte, Nuwan S. Jayasena, James M. O'Connor