Abstract: A chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. Moreover, surfaces of each of the semiconductor dies in the stepped terrace include two rows of first pads approximately parallel to edges of the semiconductor dies. Furthermore, the chip package includes a high-bandwidth ramp component, which is positioned approximately parallel to the terrace, and which has a surface that includes second pads arranged in at least two rows of second pads for each of the semiconductor dies. The second pads are electrically and mechanically coupled to the exposed first pads by connectors. Consequently, the electrical contacts in the chip package may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique.

Abstract: A chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. Moreover, surfaces of each of the semiconductor dies in the stepped terrace include two rows of first pads approximately parallel to edges of the semiconductor dies. Furthermore, the chip package includes a high-bandwidth ramp component, which is positioned approximately parallel to the terrace, and which has a surface that includes second pads arranged in at least two rows of second pads for each of the semiconductor dies. The second pads are electrically and mechanically coupled to the exposed first pads by connectors. Consequently, the electrical contacts in the chip package may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique.

Abstract: An apparatus for cooling a number of electronic components comprises an enclosure within which the components are positioned, an arrangement for circulating a cooling fluid to the components so that the cooling fluid can evaporate on or proximate the components and thereby absorb the heat generated by the components, a mechanism for condensing the evaporated cooling fluid, and a reservoir which is in fluid communication with the circulating means and within which the condensed cooling fluid collects.

Abstract: One embodiment of the present invention provides an integrated circuit module. This module includes a semiconductor die with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The module uses a flexible cable to deliver electrical power to the active face of the semiconductor die from a power distribution board located above the active face of the semiconductor die. This flexible cable provides electrical power to the semiconductor die without interfering with the alignment and heat removal functions of the module.

Abstract: An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit for a support rack, a thermal management unit fluidly connected to the heat exchanger, and a thermal conditioning unit fluidly connected to the thermal management unit and the heat exchanger. The thermal management unit directly thermally manages one or more electronic devices of the server mainboard while the heat exchanger thermally manages the exhaust air before the exhaust air exits through the outlet of the support unit of the computer server.

Abstract: A method and apparatus for computation is provided. A main cluster crossbar is connected to a plurality of statically scheduled routing processors. A first sub-cluster crossbar is associated with a first one of the plurality of statically scheduled routing processors where the first sub-cluster crossbar is connected to a first plurality of execution processors. A second sub-cluster crossbar is associated with a second one of the plurality of statically scheduled routing processors where the second sub-cluster crossbar is connected to a second plurality of execution processors.

Abstract: The present invention relates to the field of carbon, and in particular to making a carbon nanoloop. According to one embodiment, this nanoloop is made using nanomanipulators or some exotic chemistry. According to another embodiment, depending upon the cross-sectional structure of the nanoloop, it can be a conductor, an insulator, or a semi-conductor, such that two nanoloops with the same chirality exhibit the same mechanical, electrical, and magnetic properties.

Abstract: A method and apparatus for computation is provided. A main cluster crossbar is connected to a plurality of statically scheduled routing processors. A first sub-cluster crossbar is associated with a first one of the plurality of statically scheduled routing processors where the first sub-cluster crossbar is connected to a first plurality of execution processors. A second sub-cluster crossbar is associated with a second one of the plurality of statically scheduled routing processors where the second sub-cluster crossbar is connected to a second plurality of execution processors.