Abstract: A method for constructing a ramp-stacked chip assembly starts by obtaining a set of semiconductor chips, including a first chip and a set of additional chips. Next, the method stacks the set of additional chips one at a time over the first chip, wherein each additional chip is horizontally offset from a preceding additional chip to form a ramp-stack. While stacking each additional chip, the method: applies an adhesive layer to a surface of a preceding chip in the ramp-stack; and uses a vacuum tool to pick up the additional chip and place the additional chip on the adhesive layer of the preceding chip. During this pick-and-place process, the vacuum tool spans most of a surface of the additional chip and also provides planar support for the additional chip, which causes a holding force of the vacuum tool to flatten the additional chip prior to placement on the preceding chip.

Abstract: A method for constructing a ramp-stacked chip assembly starts by obtaining a set of semiconductor chips, including a first chip and a set of additional chips. Next, the method stacks the set of additional chips one at a time over the first chip, wherein each additional chip is horizontally offset from a preceding additional chip to form a ramp-stack. While stacking each additional chip, the method: applies an adhesive layer to a surface of a preceding chip in the ramp-stack; and uses a vacuum tool to pick up the additional chip and place the additional chip on the adhesive layer of the preceding chip. During this pick-and-place process, the vacuum tool spans most of a surface of the additional chip and also provides planar support for the additional chip, which causes a holding force of the vacuum tool to flatten the additional chip prior to placement on the preceding chip.

Abstract: A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.

Abstract: A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.

Abstract: According to the invention, a processing core (12) comprising a processing pipeline (100) having N-number of processing paths (56), each of which process instructions (54) on M-bit data words. In addition, the processing core (12) includes one or more register files (60), each preferably having Q-number of registers which are M-bits wide. Preferably, one of the Q-number of registers in at least one of the register files (60) is a program counter register dedicated to hold a program counter, and one of the Q-number of registers in at least one of the register files is a zero register dedicated to hold a zero value. In this manner, program jumps can be executed by adding values to the program counter in the program counter register, and memory address values can be calculated by adding values to the program counter stored in the program counter register or to the zero value stored in the zero register.

Abstract: One embodiment of the present invention provides a system that facilitates proximity communication using a bridge chip. This system includes a base chip with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The bridge chip is mounted to the base chip using a mounting, interconnection, and communication structure. The bridge chip is positioned so that a free end is proximate to a neighboring chip, thereby supporting proximity communication between the base chip and the neighboring chip.

Abstract: A novel processor chip (10) having a processing core (12), at least one bank of memory (14), an I/O link (26) configured to communicate with other like processor chips or compatible I/O devices, a memory controller (20) in electrical communication with processing core (12) and memory (14), and a distributed shared memory controller (22) in electrical communication with memory controller (20) and I/O link (26). Distributed shared memory controller (22) is configured to control the exchange of data between processor chip (10) and the other processor chips or I/O devices. In addition, memory controller (20) is configured to receive memory requests from processing core (12) and distributed shared memory controller (22) and process the memory request with memory (14). Processor chip (10) may further comprise an external memory interface (24) in electrical communication with memory controller (20). External memory interface (24) is configured to connect processor chip (10) with external memory, such as DRAM.

Abstract: An optical interconnect is provided that optically connects two adjacent printed circuit boards, or electrical component. The optical interconnect includes a floating frame which is flexibly connected to one electrical component. The floating frame includes a plurality of optical guides. The optical guides are connected to the electrical component either electronically or optically. A second frame, coupled to a second electrical component also contains a plurality of optical guides. A mechanical guide assembly positions the first frame and the second frame are optically coupled. The optical guide in the second frame connects to the second electrical component providing a path for a signal from the first electrical component to the second electrical component.

Abstract: According to the invention, a first processor chip (10) comprising a processing core (12) and at least one bank of memory (14). The at least one bank of memory (14) preferably includes a mode control input (32) for controlling the mode of the at least one bank of memory (14) between physical memory and cache memory. In addition, the first processor chip (10) may further comprise an I/O link (26) configured to facilitate communication between the first processor chip (10) and other processor chips, and a communication and memory controller (20, 22) in electrical communication with the processing core (12), the at least one bank of memory (14), and the I/O link (26).

Abstract: A novel processor chip (10) having a processing core (12), at least one bank of memory (14), an I/O link (26) configured to communicate with other like processor chips or compatible I/O devices, a memory controller (20) in electrical communication with processing core (12) and memory (14), and a distributed shared memory controller (22) in electrical communication with memory controller (20) and I/O link (26). Distributed shared memory controller (22) is configured to control the exchange of data between processor chip (10) and the other processor chips or I/O devices. In addition, memory controller (20) is configured to receive memory requests from processing core (12) and distributed shared memory controller (22) and process the memory request with memory (14). Processor chip (10) may further comprise an external memory interface (24) in electrical communication with memory controller (20). External memory interface (24) is configured to connect processor chip (10) with external memory, such as DRAM.

Abstract: According to the invention, a matrix of elements is processed in a processor. A first subset of matrix elements is loaded from a first location and a second subset of matrix elements is loaded from a second location. A third subset of matrix elements is stored in a first destination and a fourth subset of matrix elements is stored in a second destination. The loading and storing steps result from the same instruction issue.

Abstract: According to the invention, a processing core (12) comprising a processing pipeline (100) having N-number of processing paths (56), each of which process instructions (54) on M-bit data words. In addition, the processing core (12) includes one or more register files (60), each preferably having Q-number of registers which are M-bits wide. Preferably, one of the Q-number of registers in at least one of the register files (60) is a program counter register dedicated to hold a program counter, and one of the Q-number of registers in at least one of the register files is a zero register dedicated to hold a zero value. In this manner, program jumps can be executed by adding values to the program counter in the program counter register, and memory address values can be calculated by adding values to the program counter stored in the program counter register or to the zero value stored in the zero register.