Abstract: Optical components intended for telecommunications purposes must be manufactured and mounted with a great degree of accuracy, since a component, such as an optochip, when mounted must be coupled optically, electrically, mechanically and thermally at the same time. In order to obtain a right-angled geometry when using surface-emitting or surface-detecting components, and to obtain a reduced optical travel path and accurate fixation of an optofiber, a reflective surface (12) which slopes at an angle of 45 degrees is arranged between a light-conducting core (16) and the active surface (10) of an optochip, and the light-conducting core has been placed closer to the reflective surface by bevelling the optofiber (9) and fitting the fiber in a V-groove and accurately fixating the fiber in the groove by means of a flat cover means (20).

Abstract: An impermeable encapsulated optocomponent and a method for encapsulating an optocomponent includes providing a base, preferably of silicon, supporting waveguides and an optoelectronic component optically coupled to each other. The optoelectronic component is connected to electric driver circuits. Thereafter a silica layer is deposited over a region of the substrate including at least the coupling of the waveguide and optoelectronic component, after which it is encapsulated by applying a layer of curable plastics material. The deposition of silica provides an impermeable inner encapsulation layer and prevents, when applying the curable plastics material, plastics from penetrating between the inner ends of the waveguides and the optoelectronic component, and thus the optical coupling is secured therebetween.