Abstract: Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.

Abstract: Embodiments of the invention provide a photo mask capable of simultaneously forming trenches for preventing an under-fill leakage in a process of forming an opening of a solder resist. In accordance with at least one embodiment, the photo mask includes a transparent base material having a non-transmitting film formed on one surface thereof, a semi-transmitting region formed by performing selective etching using a laser on the transparent base material, a transmitting region and a non-transmitting region formed on the transparent base material together with the semi-transmitting region, and an opening of a solder resist and trenches for preventing a leakage of an under-fill liquid or EMC mold may be simultaneously formed using the photo mask.

Abstract: Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board including: preparing a carrier member including a metal layer and a transfer circuit pattern sequentially formed on one surface thereof; preparing a base substrate having an inner layer circuit; forming an insulating layer on the base substrate; disposing the carrier member so that the transfer circuit pattern faces the insulating layer; embedding the transfer circuit pattern in the insulating layer through a heating and compressing process; and removing the carrier member, wherein the metal layer has a melting point lower than that of the transfer circuit pattern.