Patents by Inventor Oksen Toros Baris

Oksen Toros Baris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspection for multiple process steps in a single inspection process
    Patent number: 10712289
    Abstract: Various embodiments for detecting defects on a wafer are provided. One method includes acquiring output generated by an inspection system for a wafer during an inspection process that is performed after at least first and second process steps have been performed on the wafer. The first and second process steps include forming first and second portions, respectively, of a design on the wafer. The first and second portions of the design are mutually exclusive in space on the wafer. The method also includes detecting defects on the wafer based on the output and determining positions of the defects with respect to the first and second portions of the design. In addition, the method includes associating different portions of the defects with the first or second process step based on the positions of the defects with respect to the first and second portions of the design.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: July 14, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Oksen Toros Baris, Raghav Babulnath
  • Inspection for Multiple Process Steps in a Single Inspection Process
    Publication number: 20160033420
    Abstract: Various embodiments for detecting defects on a wafer are provided. One method includes acquiring output generated by an inspection system for a wafer during an inspection process that is performed after at least first and second process steps have been performed on the wafer. The first and second process steps include forming first and second portions, respectively, of a design on the wafer. The first and second portions of the design are mutually exclusive in space on the wafer. The method also includes detecting defects on the wafer based on the output and determining positions of the defects with respect to the first and second portions of the design. In addition, the method includes associating different portions of the defects with the first or second process step based on the positions of the defects with respect to the first and second portions of the design.
    Type: Application
    Filed: July 27, 2015
    Publication date: February 4, 2016
    Inventors: Oksen Toros Baris, Raghav Babulnath