Abstract: An image sensor comprising an image sensor layer having a plurality of image sensor layer contact pads; and a plurality of photo-sensitive elements, each being coupled to a respective image sensor layer contact pad; and a capacitor layer having: a plurality of first capacitor contact structures, each being constituted by a capacitor layer top contact pad bonded to a respective image sensor layer contact pad of the image sensor layer; a plurality of second capacitor contact structures; and a plurality of capacitors, embedded in a first dielectric material, each capacitor including at least one electrically conductive vertical nanostructure electrically conductively connected to one of a respective first capacitor contact structure and a respective second capacitor contact structure, and conductively separated from the other one of the respective first capacitor contact structure and the respective second capacitor contact structure by a layer of a second dielectric material.

Abstract: A MIM energy storage device comprising a bottom electrode; a plurality of electrically conductive vertical nanostructures; a bottom conduction-controlling layer conformally coating each nanostructure in the plurality of electrically conductive vertical nanostructures; and a layered stack of alternating conduction-controlling layers and electrode layers conformally coating the bottom conduction-controlling layer, the layered stack including at least a first odd-numbered electrode layer at a bottom of the layered stack, a first odd-numbered conduction-controlling layer directly on the first odd-numbered electrode layer, and a first even-numbered electrode layer directly on the first odd-numbered conduction-controlling layer. Each even-numbered electrode layer in the layered stack is electrically conductively connected to the bottom electrode; and each odd-numbered electrode layer in the layered stack is electrically conductively connected to any other odd-numbered electrode layer in the layered stack.

Abstract: An electronic system comprising a substrate with a substrate conductor pattern including substrate pads; a semiconductor component with active circuitry, and component pads coupled to the active circuitry of the semiconductor component and connected to the substrate pads of the substrate; a power source interface for receiving power from a power source; and a power distribution network for distributing power from the power source interface to the active circuitry of the semiconductor component. The power distribution network includes a first capacitor realized by conductive structures comprised in the semiconductor component, the first capacitor being coupled to a first component pad and a second component pad of the semiconductor component; a second capacitor arranged between the substrate and the semiconductor component, the second capacitor being coupled to the first component pad and the second component pad of the component package; and a power grid portion of the substrate conductor pattern.

Abstract: A discrete metal-insulator-metal (MIM) energy storage component, the energy storage component comprising: a MIM-arrangement comprising: a first electrode layer; a plurality of conductive nanostructures grown from the first electrode layer; a conduction controlling material covering each nanostructure in the plurality of conductive nanostructures and the first electrode layer uncovered by the conductive nanostructures; and a second electrode layer covering the conduction controlling material; a first connecting structure for external electrical connection of the capacitor component; a second connecting structure for external electrical connection of the capacitor component; and an electrically insulating encapsulation material at least partly embedding the MIM-arrangement.

Abstract: A semiconductor assembly, comprising: a first semiconductor die including processing circuitry and pads, said first semiconductor die having a first surface and a second surface opposite the first surface; a second semiconductor die including memory circuitry and pads, said second semiconductor die being arranged on one of the first surface and the second surface of said first semiconductor die, and pads of said second semiconductor die being coupled to pads of said first semiconductor die; and at least a first capacitor having terminals, said first capacitor being arranged on one of the first surface and the second surface of said first semiconductor die and the terminals of said capacitor being coupled to pads of said first semiconductor die.

Abstract: Systems and methods for providing an advertisement platform where buyers and sellers can trade advertisement inventory programmatically at local, national, and/or worldwide levels. The advertisement platform server system may include an advertiser facing interface which permits advertisers to generate a request for orders (RFO) for an advertisement campaign which spans multiple advertisement channels. The RFO may be automatically provided to numerous media content providers, which may place committed orders which are to be autonomously accepted upon satisfaction of at least one condition of the RFO, such as a minimum budget. Once the committed orders are accepted, the advertisements may be routed to a traffic management system for publishing.

Abstract: Systems and methods for providing an advertisement platform where buyers and sellers can trade advertisement inventory programmatically at local, national, and/or worldwide levels. The advertisement platform server system may include an advertiser facing interface which permits advertisers to generate a request for orders (RFO) for an advertisement campaign which spans multiple advertisement channels. The RFO may be automatically provided to numerous media content providers, which may place committed orders which are to be autonomously accepted upon satisfaction of at least one condition of the RFO, such as a minimum budget. Once the committed orders are accepted, the advertisements may be routed to a traffic management system for publishing.

Abstract: Method for optimising the placement of at least two pieces of information in at least one display section of a display area managed by a system, wherein said system communicates with an Information Optimization Center through the sending and receiving of packets of instructions and/or requests, wherein said packets of instructions comprise data regarding a location of at least one piece of information and instructions regarding at least two pieces of information are sent in the same packet.

Abstract: Method for optimising the placement of at least two pieces of information in at least one display section of a display area managed by a system, wherein said system communicates with an Information Optimisation Centre through the sending and receiving of packets of instructions and/or requests, wherein said packets of instructions comprise data regarding a location of at least one piece of information and instructions regarding at least two pieces of information are sent in the same packet.