Abstract: A method for manufacturing an organic device includes the steps of applying a photoresist onto at least an active first region arranged on a substrate of the organic device, and removing the photoresist from the substrate in a second region adjacent to the active first region. Additionally, the method includes the steps of applying a passivation layer onto the first and second regions and removing the photoresist and the passivation layer in the active first region.

Abstract: A method for manufacturing an organic device includes the steps of applying a photoresist onto at least an active first region arranged on a substrate of the organic device, and removing the photoresist from the substrate in a second region adjacent to the active first region. Additionally, the method includes the steps of applying a passivation layer onto the first and second regions and removing the photoresist and the passivation layer in the active first region.

Abstract: The invention relates to an arrangement including optically transparent and/or functional components. It is desirable for many applications to achieve a high functionality and variability in the utilization of electronic components over a very small area or with a small space requirement for such a design. In an arrangement in accordance with the invention, an organic electronic component and at least one further organic or inorganic electronic component are arranged layer-wise, stacked over one another, on a substrate. In this respect, planar electrically conductive electrodes at the surfaces of the components are formed such that the components are electrically connected in series and the components are each individually electrically controllable via the electrodes in accordance with their polarities.