Abstract: Apparatus and method for filling holes and other flaws in substantially planar surfaces such as walls and floors of structural buildings. The invention includes an independent template having a bore therethrough. An alternative embodiment comprises a filler material receiving tray, a bottom portion of which is a template with a bore therethrough and constructed integrally therewith. A tapered and funnel shaped rim is provided to an exterior of the bore for insertion into the hole to be filled. Additionally, an extension tube may be provided for conveying the filler material to holes and recesses below a planar surface. It is contemplated that a mixing and storage section may be constructed integrally therewith for the filler material prior to distribution through the bore.