Abstract: A method of manufacturing a printed wiring assembly “PWA” on a substrate, includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.

Abstract: A method and an apparatus for detecting a modification of a compound, the modification occurring during a transient period. The method may include: coupling at least one substance portion comprising ferro elastic material to a compound, the substance portion being configured to change a polarization level thereof continuously in response to a strain gradient applied thereto over the a transient period which results in said modification; sensing a physical property of said substance portion affected by the polarization level of the substance portion, due to the modification; and determining, using a computer processor, the modification, based on the sensed physical property of the substance portion.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: A system and a method of monitoring physical properties of a physical medium over time are provided herein. The method may include the following steps: embedding a plurality of acoustic sensors into a physical medium before curing thereof; transmitting an acoustic wave by at least one transmitter coupled to or embedded within said physical medium; repeatedly calculating, over different points of time, a travel time of said acoustic wave between the at least one transmitter and the plurality of acoustic sensors; and analyzing said travel times, to detect a change over time in physical properties of said physical medium associated with said travel time.

Abstract: A method and an apparatus for detecting a modification of a compound, the modification occurring during a transient period. The method may include: coupling at least one substance portion comprising ferro elastic material to a compound, the substance portion being configured to change a polarization level thereof continuously in response to a strain gradient applied thereto over the a transient period which results in said modification; sensing a physical property of said substance portion affected by the polarization level of the substance portion, due to the modification; and determining, using a computer processor, the modification, based on the sensed physical property of the substance portion.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: Substantially leachless, agent-encapsulating sol-gel particles, methods of preparing same and products containing same are provided.

Abstract: The invention relates to pharmaceutical or cosmetic compositions preferably in the form of microcapsules or microparticles which include at least one active ingredient and an oil or a mixture of oils wherein the oil or mixture of oils alone or in combination with the active ingredient have a specific gravity higher than the specific gravity of water. The invention further relates to a process for preparing said compositions.

Abstract: The invention relates to microcapsules having a core material encapsulated within a microcapsular shell, the core material comprises at least one active ingredient, wherein the microcapsular shell comprises at least one inorganic polymer comprising polymerized precursors obtained by in-situ polymerization of the precursors; wherein the concentration of the core material based total weight of the microcapsules is above 95% w/w. The invention further relates to a composition and to a suspension comprising the microcapsules. The invention additionally relates to a process for preparing the microcapsules.

Abstract: Substantially leachless, agent-encapsulating sol-gel particles, methods of preparing same and products containing same are provided.

Abstract: Substantially leachless, agent-encapsulating sol-gel particles, methods of preparing same and products containing same are provided.

Abstract: The invention relates to microcapsules having a core material encapsulated within a microcapsular shell, the core material comprises at least one active ingredient, wherein the microcapsular shell comprises at least one inorganic polymer comprising polymerized precursors obtained by in-situ polymerization of the precursors; wherein the concentration of the core material based total weight of the microcapsules is above 95% w/w. The invention further relates to a composition and to a suspension comprising the microcapsules. The invention additionally relates to a process for preparing the microcapsules.

Abstract: Substantially leachless, agent-encapsulating sol-gel particles, methods of preparing same and products containing same are provided

Abstract: The invention relates to pharmaceutical or cosmetic compositions preferably in the form of microcapsules or microparticles which include at least one active ingredient and an oil or a mixture of oils wherein the oil or mixture of oils alone or in combination with the active ingredient have a specific gravity higher than the specific gravity of water. The invention further relates to a process for preparing said compositions.

Abstract: A positive acting, composition that can be heat-sensitive is presented, either coated on a lithographic base, or on a printing circuit board base, and comprises a water soluble heat-sensitive resin, a novel adhesion promoter and a radiation absorbing agent—a dye or a pigment. An excellent film forming polymer that comprises acetal units directly pendant from the polymer polyvinyl alcohol backbone may be the only binder resin, when other resins being optional. The solubility of the coated material in the areas exposed to near -IR laser radiation in mild alkaline developers becomes considerably higher, allowing to obtain high resolved patterns of the etch-resistant material on printing circuit boards or lithographic printing plates. The composition can be applied on the substrate from a liquid of laminated as a dry film. Sensitizers may be added to render the composition sensitive to radiation in a non-thermal sense.

Abstract: A positive acting, heat-sensitive composition is presented, either coated on a lithographic base, or on a printing circuit board base, and comprises a water insoluble heat-sensitive resin, a novel adhesion promoter and a radiation absorbing agent—a dye or a pigment. An excellent film forming polymer that comprises acetal units directly pendant from the polymer polyvinyl alcohol backbone may be the only binder resin, when other resins being optional. The solubility of the coated material in the areas exposed to near-IR laser radiation in mild alkaline developers becomes considerably higher, allowing to obtain high resolved patterns of the etch-resistant material on printing circuit boards or lithographic printing plates. The composition can be applied on the substrate from a liquid or laminated as a dry film.