Patents by Inventor Oliver Jackl

Oliver Jackl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer and method for producing holes in an interposer
    Patent number: 11744015
    Abstract: An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10?6/K to 3.4×10?6/K. The interposer further includes a number of holes having diameters ranging from 20 ?m to 200 ?m. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: August 29, 2023
    Assignee: SCHOTT AG
    Inventor: Oliver Jackl
  • INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER
    Publication number: 20200045817
    Abstract: An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10?6/K to 3.4×10?6/K. The interposer further includes a number of holes having diameters ranging from 20 ?m to 200 ?m. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.
    Type: Application
    Filed: October 11, 2019
    Publication date: February 6, 2020
    Applicant: Schott AG
    Inventor: Oliver JACKL
  • INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER
    Publication number: 20190157218
    Abstract: An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a plate-shaped base substrate made of glass with a number of holes ranging from 10 to 10.000 cm?2. Conductive paths run on one surface of the board, extend into respective holes, and extend through the holes to the other surface of the plate in order to form connection points for the chip. The holes are produced in two steps: first filamentary channels are prepared, and second the filamentary channels are widened by etching so as to get typical roughness as from etching.
    Type: Application
    Filed: January 24, 2019
    Publication date: May 23, 2019
    Applicant: Schott AG
    Inventor: Oliver JACKL
  • INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER
    Publication number: 20130210245
    Abstract: An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10?6/K to 3.4×10?6/K. The interposer further includes a number of holes having diameters ranging from 20 ?m to 200 ?m. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.
    Type: Application
    Filed: July 4, 2011
    Publication date: August 15, 2013
    Applicant: SCHOTT AG
    Inventor: Oliver Jackl