Patents by Inventor Oliver M. Ledon

Oliver M. Ledon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails
    Patent number: 6762067
    Abstract: A method and arrangement for packaging a plurality of chip devices. The method includes providing a plurality of bottom leadframes coupled together with rails to form a bottom leadframe assembly and providing a plurality of top leadframes coupled together with rails to form a top leadframe assembly. Dies are placed between the top and bottom leadframes and the top and bottom leadframe assemblies are coupled to one another. The dies are attached to die attach pads of the bottom leadframes and are coupled to the top leadframes with solder bumps. A molded body is placed around the top and bottom leadframes with the dies therebetween and the rails are removed from the top and bottom leadframes, thus providing a plurality of chip devices.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: July 13, 2004
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Maria Clemens Y. Quinones, Gilmore S. Baje, Maria Christina B. Estacio, Marvin R. Gestole, Oliver M. Ledon, Santos E. Mepieza