Abstract: A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.

Abstract: An electronic device includes a support substrate. A face is covered with a soldermask layer. At least part of the soldermask layer includes roughnesses providing a rough grip surface. An electronic die is mounted on the support substrate. A molding resin encapsulates the electronic die and partially or completely covers the soldermask layer.

Abstract: A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.

Abstract: A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.

Abstract: A substrate includes a through cavity. A heat sink is mounted so as to close one end of the through cavity. An integrated circuit (IC) chip is also mounted in the cavity. Conductive wires provide an electrical connection between pads on an upper surface of the IC chip and metallizations on the substrate. The mounted heat sink is positioned within the substrate in one implementation and positioned mounted to a back surface of the substrate in another implementation.

Abstract: A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.

Abstract: An optical system with an optical package capable of being assembled in advance. The optical package comprises a body that contains an integrated-circuit chip having an optical sensor on its front face, a ring and an optical device intended to be placed in front of the said optical sensor. Adhesive is deposited on the internal thread (3) of the ring (2) and/or on the external thread (7) of the optical device (5). The optical device (5) is screwed into the ring (2) as far as an entered position. The ring (2), which is provided with the optical device (5), is affixed to the body (12) of the package (11). In order to bring the optical device (5) to an adjustment position relative to the said optical sensor (14), the said adjustment position being away from its entered position, the optical device is unscrewed relative to the ring. A treatment (19) is then applied to the adhesive (10) so as to fix the optical device (5) in the said ring (2) at the adjustment position reached.

Abstract: An optical system with an optical package capable of being assembled in advance. The optical package comprises a body that contains an integrated-circuit chip having an optical sensor on its front face, a ring and an optical device intended to be placed in front of the said optical sensor. Adhesive is deposited on the internal thread (3) of the ring (2) and/or on the external thread (7) of the optical device (5). The optical device (5) is screwed into the ring (2) as far as an entered position. The ring (2), which is provided with the optical device (5), is affixed to the body (12) of the package (11). In order to bring the optical device (5) to an adjustment position relative to the said optical sensor (14), the said adjustment position being away from its entered position, the optical device is unscrewed relative to the ring. A treatment (19) is then applied to the adhesive (10) so as to fix the optical device (5) in the said ring (2) at the adjustment position reached.