Abstract: A propeller blade comprising a composite member. The composite member comprises a stack of plies and a matrix in which the stack of plies is embedded. At least one ply comprises a plurality of first yarns aligned in a first direction defining a plane of the ply and a plurality of second yarns extending transverse to the plane of the ply. Each second yarn does not extend through more than one ply. Also provided is a propelling system comprising the propeller blade, a composite propeller blade prepreg, and a method of forming a propeller blade.

Abstract: An aircraft fuselage comprising a structure, a skin connected to the structure and forming a barrier between the interior and the exterior of the fuselage, an external coating being plated or placed against said skin, wherein the external coating comprises a thermal insulator that covers the fuselage at least in part and has at least one foam insulating layer. The external coating comprises a plurality of juxtaposed panels adhesively bonded to the fuselage and/or secured to the fuselage by mechanical fixings.

Abstract: An aircraft fuselage comprising a structure, a skin connected to the structure and forming a barrier between the interior and the exterior of the fuselage, an external coating being plated or placed against said skin, wherein the external coating comprises a thermal insulator that covers the fuselage at least in part and has at least one foam insulating layer. The external coating comprises a plurality of juxtaposed panels adhesively bonded to the fuselage and/or secured to the fuselage by mechanical fixings.

Abstract: Support for cables intended in particular for aeronautic construction This support is provided with a metal profiled structure (2) having at least one housing (10) intended to receive cables (4) or similar components. This structure (2) in turn has a face intended to be braced against a load-bearing wall, and the said face is covered with a layer of insulating material (12).

Abstract: A semiconductor memory device includes a plurality of integrated circuit modules each having a plurality of module elements and at least one adjustable module element. At least one fuse box is electrically connected to the plurality of integrated circuit modules. The fuse box has a plurality of programmable fuse elements, that, when programmed, adjust the adjustable module element.

Abstract: A semiconductor memory device includes a plurality of integrated circuit modules each having a plurality of module elements and at least one adjustable module element. At least one fuse box is electrically connected to the plurality of integrated circuit modules. The fuse box has a plurality of programmable fuse elements, that, when programmed, adjust the adjustable module element.