Patents by Inventor Olli Pekka Koistinen

Olli Pekka Koistinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210306811
    Abstract: According to an example aspect of the present invention, there is provided a method and system for tracking and determining a position of an object along a planned route, the method comprising: providing information of at least one predetermined route and determining a planned route based on the information of the at least one predetermined route; determining a primary position of the object based on at least one of: signals received from a satellite positioning system and the planned route; tracking a first position of the object via the satellite positioning system; and comparing whether the first position matches with the planned route. If the first position is found to deviate from the planned route, determining a secondary position of movement of the object based on measurements of at least one of: an inertia sensor and an acceleration sensor; wherein at least one of acceleration, speed and direction of the object is measured.
    Type: Application
    Filed: June 10, 2021
    Publication date: September 30, 2021
    Inventors: Tuomas Hapola, Heikki Nieminen, Mikko Martikka, Erik Lindman, Olli-Pekka Koistinen
  • Publication number: 20030198032
    Abstract: The invention relates to an integrated circuit assembly and a method of making same. The method according to the invention comprising providing a flex substrate having one or more dielectric tape layers, assembling one or more semiconductor chips to said flex substrate, said semiconductor chips having an active surface and a plurality of contact pads on said active surface, providing one or more conductive layers on said flex substrate, said conductive layers forming the electrical connections required for the assembly, electrically connecting the contact pads to the conductive layers.
    Type: Application
    Filed: April 23, 2002
    Publication date: October 23, 2003
    Inventors: Paul Collander, Petri Nyberg, Vesa Korhonen, Olli Pekka Koistinen, Kari Koivunen