Abstract: A system is provided for providing vibration isolation and acceleration compensation for a device such as a vibration-sensitive oscillator or sensor. The system has an assembly that moves or vibrates relative to an external component. The assembly includes a plurality of components mounted to either side of a PCB. One or more accelerometers are configured to detect acceleration of the PCB in at least one of an X-axis direction, a Y-axis direction, and a Z-axis direction. The system includes plurality of isolators coupled to the assembly and configured to isolate or dampen vibrations that would otherwise transfer to the assembly from an underlying component to which the assembly is configured to attach to. In certain embodiments, the isolators are located between the assembly and the underlying component within vertical confines of an exterior perimeter of the PCB.

Abstract: A system is provided for providing vibration isolation and acceleration compensation for a device such as a vibration-sensitive oscillator or sensor. The system has an assembly that moves or vibrates relative to an external component. The assembly includes a plurality of components mounted to either side of a PCB. One or more accelerometers are configured to detect acceleration of the PCB in at least one of an X-axis direction, a Y-axis direction, and a Z-axis direction. The system includes plurality of isolators coupled to the assembly and configured to isolate or dampen vibrations that would otherwise transfer to the assembly from an underlying component to which the assembly is configured to attach to. In certain embodiments, the isolators are located between the assembly and the underlying component within vertical confines of an exterior perimeter of the PCB.

Abstract: A microelectromechanical vibration and stress isolation system is provided. The system includes an isolation platform configured to support a transducer and having an outer perimeter. A frame surrounds the isolation platform and has inner edge surfaces that are spaced from and face the outer edge surfaces of the platform. A spring connects the isolation platform to the frame. The spring is generally L-shaped, having a first leg that connects one inner edge surface to an outer edge surface while extending around a corner of the platform.

Abstract: A system is provided for providing vibration isolation and acceleration compensation for a device such as a vibration-sensitive oscillator or sensor. The system has an assembly that moves or vibrates relative to an external component. The assembly includes a plurality of components mounted to either side of a PCB. One or more accelerometers are configured to detect acceleration of the PCB in at least one of an X-axis direction, a Y-axis direction, and a Z-axis direction. The system includes plurality of isolators coupled to the assembly and configured to isolate or dampen vibrations that would otherwise transfer to the assembly from an underlying component to which the assembly is configured to attach to. In certain embodiments, the isolators are located between the assembly and the underlying component within vertical confines of an exterior perimeter of the PCB.

Abstract: A space-efficient, planar interposer for packaging and support of a device (e.g., MEMS device) is provided. The interposer has a device-mounting region for supporting a device, such as a sensor, accelerometer, gyroscope, etc. The interposer is formed from a single layer of material, and has cut-outs or gaps formed therein to define springs. The springs connect the device-mounting region to anchor regions configured to anchor the interposer to an underlying substrate or package. The cut-outs or gaps of the interposer are made with space-efficiency in mind. In certain embodiments, the cut-outs or gaps extend inwardly toward the center of the interposer such that the anchor regions can also extend inwardly, and at least a portion of each anchor region is further inboard on the interposer than a portion of the device-mounting region. As such, the anchor regions can be located within an extended or virtual perimeter of the device-mounting region.

Abstract: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

Abstract: A microelectromechanical vibration and stress isolation system is provided. The system includes an isolation platform configured to support a transducer and having an outer perimeter. A frame surrounds the isolation platform and has inner edge surfaces that are spaced from and face the outer edge surfaces of the platform. A spring connects the isolation platform to the frame. The spring is generally L-shaped, having a first leg that connects one inner edge surface to an outer edge surface while extending around a corner of the platform.

Abstract: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

Abstract: A microactuator may be configured by activating a source of electromagnetic radiation to heat and melt a selected set of phase-change plugs embedded in a substrate of the microactuator, pressurizing a common pressure chamber adjacent to each of the plugs to deform the melted plugs, and deactivating the source of electromagnetic radiation to cool and solidify the melted plugs.

Abstract: A microactuator may be configured by activating a source of electromagnetic radiation to heat and melt a selected set of phase-change plugs embedded in a substrate of the microactuator, pressurizing a common pressure chamber adjacent to each of the plugs to deform the melted plugs, and deactivating the source of electromagnetic radiation to cool and solidify the melted plugs.

Abstract: A microactuator may be configured by activating a source of electromagnetic radiation to heat and melt a selected set of phase-change plugs embedded in a substrate of the microactuator, pressurizing a common pressure chamber adjacent to each of the plugs to deform the melted plugs, and deactivating the source of electromagnetic radiation to cool and solidify the melted plugs.

Abstract: The present invention provides compositions providing and methods using fluorescence detection device, comprising an electroluminescent light (EL) source, for measuring fluorescence in biological samples. In particularly preferred embodiments, the present invention provides an economical, battery powered and Hand-held device for detecting fluorescent light emitted from reporter molecules incorporated into DNA, RNA, proteins or other biological samples, such as a fluorescence emitting biological sample on a microarray chip. Further, a real-time hand-held PCR Analyzer device comprising an EL light source for measuring fluorescence emissions from amplified DNA is provided.

Abstract: A microactuator may be configured by activating a source of electromagnetic radiation to heat and melt a selected set of phase-change plugs embedded in a substrate of the microactuator, pressurizing a common pressure chamber adjacent to each of the plugs to deform the melted plugs, and deactivating the source of electromagnetic radiation to cool and solidify the melted plugs.