Patents by Inventor Onur Demirer

Onur Demirer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for process control with flexible sampling
    Patent number: 10754260
    Abstract: The generation of flexible sparse metrology sample plans includes receiving a full set of metrology signals from one or more wafers from a metrology tool, determining a set of wafer properties based on the full set of metrology signals and calculating a wafer property metric associated with the set of wafer properties, calculating one or more independent characterization metrics based on the full set of metrology signals, and generating a flexible sparse sample plan based on the set of wafer properties, the wafer property metric, and the one or more independent characterization metrics. The one or more independent characterization metrics of the one or more properties calculated with metrology signals from the flexible sparse sampling plan is within a selected threshold from one or more independent characterization metrics of the one or more properties calculated with the full set of metrology signals.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: August 25, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Onur Demirer, Roie Volkovich, William Pierson, Mark Wagner, Dana Klein
  • Method and System for Process Control with Flexible Sampling
    Publication number: 20160370718
    Abstract: The generation of flexible sparse metrology sample plans includes receiving a full set of metrology signals from one or more wafers from a metrology tool, determining a set of wafer properties based on the full set of metrology signals and calculating a wafer property metric associated with the set of wafer properties, calculating one or more independent characterization metrics based on the full set of metrology signals, and generating a flexible sparse sample plan based on the set of wafer properties, the wafer property metric, and the one or more independent characterization metrics. The one or more independent characterization metrics of the one or more properties calculated with metrology signals from the flexible sparse sampling plan is within a selected threshold from one or more independent characterization metrics of the one or more properties calculated with the full set of metrology signals.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 22, 2016
    Inventors: Onur Demirer, Roie Volkovich, William Pierson, Mark Wagner, Dana Klein