Patents by Inventor Orlando L. Valentin
Orlando L. Valentin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11364565Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.Type: GrantFiled: November 25, 2020Date of Patent: June 21, 2022Assignee: Kulicke and Soffa Industries, Inc.Inventors: Christoph B. Luechinger, Orlando L. Valentin
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Publication number: 20210078099Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.Type: ApplicationFiled: November 25, 2020Publication date: March 18, 2021Inventors: Christoph B. Luechinger, Orlando L. Valentin
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Patent number: 10882134Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.Type: GrantFiled: April 3, 2018Date of Patent: January 5, 2021Assignee: Kulicke and Soffa Industries, Inc.Inventors: Christoph B. Luechinger, Orlando L. Valentin
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Publication number: 20200290148Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.Type: ApplicationFiled: April 3, 2018Publication date: September 17, 2020Inventors: Christoph B. Luechinger, Orlando L. Valentin
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Patent number: 9527189Abstract: A system for processing a solar substrate is provided. The system includes a support structure for supporting a solar substrate. The system also includes a brushing system for selectively removing an interaction layer from an electrode region of the solar substrate.Type: GrantFiled: September 26, 2014Date of Patent: December 27, 2016Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Erich C. Mueller, Orlando L. Valentin, Tao Xu
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Publication number: 20150017878Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.Type: ApplicationFiled: September 26, 2014Publication date: January 15, 2015Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Erich C. Mueller, Orlando L. Valentin, Tao Xu
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Patent number: 8746537Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.Type: GrantFiled: October 22, 2013Date of Patent: June 10, 2014Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20140048584Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.Type: ApplicationFiled: October 22, 2013Publication date: February 20, 2014Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130306708Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: ApplicationFiled: July 22, 2013Publication date: November 21, 2013Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8584922Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: GrantFiled: July 22, 2013Date of Patent: November 19, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130299559Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: ApplicationFiled: July 15, 2013Publication date: November 14, 2013Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8573468Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: GrantFiled: July 15, 2013Date of Patent: November 5, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8544717Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: GrantFiled: April 29, 2011Date of Patent: October 1, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8511536Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: GrantFiled: March 30, 2011Date of Patent: August 20, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130140346Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: ApplicationFiled: March 30, 2011Publication date: June 6, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130042960Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: ApplicationFiled: April 29, 2011Publication date: February 21, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20120273554Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: ApplicationFiled: July 2, 2012Publication date: November 1, 2012Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin
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Publication number: 20120080507Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: ApplicationFiled: October 3, 2011Publication date: April 5, 2012Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin