Patents by Inventor Orville Brown

Orville Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-Free And Cadmium-Free Conductive Copper Thick Film Pastes
    Publication number: 20070108423
    Abstract: Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.
    Type: Application
    Filed: December 13, 2006
    Publication date: May 17, 2007
    Applicant: FERRO CORPORATION
    Inventors: Orville Brown, Srinivasan Sridharan
  • Lead-free and cadmium-free conductive copper thick film pastes
    Publication number: 20050277550
    Abstract: Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.
    Type: Application
    Filed: June 9, 2004
    Publication date: December 15, 2005
    Applicant: Ferro Corporation
    Inventors: Orville Brown, Srinivasan Sridharan