Patents by Inventor Osami Tsuda

Osami Tsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4257834
    Abstract: A process for manufacturing a sheet having a chip-like design composed of a plurality of chips densely aligned in a plane without overlapping and a solidified binder uniformly filling the interstices among the chips and firmly and integrally bonding the chips to one another in sheet form. The sheet is useful as a floor material, wall material, and the like.
    Type: Grant
    Filed: April 5, 1979
    Date of Patent: March 24, 1981
    Assignee: Takiron Co., Ltd.
    Inventors: Kosuke Iida, Tadayuki Morikawa, Mitsuo Aoki, Isamu Ueda, Takashi Butsuda, Osami Tsuda