Patents by Inventor Osamo Sugiyama

Osamo Sugiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Publication number: 20030094675
    Abstract: A semiconductor device in which accuracy in mounting and positioning a semiconductor chip onto a package is improved without being affected by operation of a mounting unit such as a die bonder. The semiconductor device includes a semiconductor chip disposed on a die pad section of the package using guide projections and spring projections provided around the die pad section. The semiconductor chip is die bonded while being aligned with reference to the guide projections.
    Type: Application
    Filed: October 30, 2002
    Publication date: May 22, 2003
    Applicant: Fuji Electric Co. Ltd.
    Inventors: Toshio Yamamoto, Akio Izumi, Osamo Sugiyama