Patents by Inventor Osamu Deguchi

Osamu Deguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8196292
    Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: June 12, 2012
    Assignee: Daisho Denshi Co., Ltd.
    Inventors: Akihiro Kimura, Osamu Deguchi, Koji Annou, Atsushi Ishikawa
  • Patent number: 7963029
    Abstract: A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: June 21, 2011
    Assignee: Daisho Denshi Co., Ltd.
    Inventors: Atsushi Ishikawa, Osamu Deguchi, Katsuyoshi Kameyama, Makoto Nagaoka, Akihiro Kimura
  • Publication number: 20100050430
    Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 4, 2010
    Applicant: DAISHO DENSHI CO., LTD.
    Inventors: Akihiro Kimura, Osamu Deguchi, Koji Annou, Atsushi Ishikawa
  • Patent number: 7600313
    Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: October 13, 2009
    Assignee: Daisho Denshi Co., Ltd.
    Inventors: Akihiro Kimura, Osamu Deguchi, Koji Annou, Atsushi Ishikawa
  • Publication number: 20070266556
    Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.
    Type: Application
    Filed: July 9, 2004
    Publication date: November 22, 2007
    Applicant: DAISHO DENSHI CO., LTD.
    Inventors: Akihiro Kimura, Osamu Deguchi, Koji Annou, Atsushi Ishikawa
  • Publication number: 20060112543
    Abstract: A jig for holding and conveyance having a weak-adherence adhesive pattern on a plate surface on which a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate is placed and held. The weak-adherence adhesive pattern is formed by being restricted to a position corresponding to non-conductive portion. A jig for holding and conveyance is also disclosed which has a fluorine-based resin layer on a plate surface on which a printed circuit board having a conductive pattern on the surface of an insulating substrate is placed and held. On the fluorine-based resin layer, the printed circuit board is held so that the conductor pattern surface of the printed circuit board is approximately parallel to the plate surface.
    Type: Application
    Filed: July 15, 2003
    Publication date: June 1, 2006
    Inventors: Atsushi Ishikawa, Osamu Deguchi, Katsuyoshi Kameyama, Makoto Nagaoka, Akihiro Kimura
  • Patent number: 4314524
    Abstract: Apparatus comprising a vertically movable arm member pivoted at one end about a vertical axis and a chucking head mounted at the other distal end thereof, for engagement with and holding an apertured article, said chucking head being arranged to rotate the chucked article and whereby apertured articles being successively fed to a loading position are subjected to a revolving movement and an upward movement while being transferred to an unloading position via a working position where they are subjected to a desired treatment.
    Type: Grant
    Filed: March 5, 1980
    Date of Patent: February 9, 1982
    Assignee: NTN Toyo Bearing Company, Limited
    Inventor: Osamu Deguchi
  • Patent number: 4071149
    Abstract: An apparatus is disclosed wherein annular articles conveyed one by one to a chute member are successively transferred to a rail member connected to the chute member until a predetermined number of articles are lined up thereon, whereupon a plurality of slender holders waiting their turn above the individual articles are lowered and then lifted in unison, whereby the holders pass through the apertures of the articles in their downward travel and in their upward travel they lift the articles in unison which are held in position as a result of projectable members installed at the front ends of the holders being projected in connection with the upward movement of the holders, the above operation being repeatedly carried out a plurality of times until each holder is loaded with a desired number of articles piled in a stack, the stacks of articles on the individual holders being then released in unison onto a table member, the latter being adapted to be inched each time it receives the stacks so that such articles
    Type: Grant
    Filed: June 22, 1976
    Date of Patent: January 31, 1978
    Assignee: NTN Toyo Bearing Co. Ltd.
    Inventor: Osamu Deguchi