Patents by Inventor Osamu Fukuroi

Osamu Fukuroi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040259474
    Abstract: The heaters in the respective thin-film magnetic head in the bar are electrically connected to its neighbors, and a variable resistor is connected to each of the heaters in parallel. The resistance of each of the variable resistors is varied depending on the amount that the medium-opposing surface (ABS) of the thin-film magnetic head is to project. Also, the medium-opposing surface of the thin-film magnetic head in the magnetic head bar is polished while energizing all the heaters by the same power supply.
    Type: Application
    Filed: April 13, 2004
    Publication date: December 23, 2004
    Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.
    Inventors: Nobuya Oyama, Norikazu Ota, Soji Koide, Tetsuro Sasaki, Osamu Fukuroi
  • Patent number: 6679760
    Abstract: A lapping method of a magnetic head slider provided with an element-forming surface, an ABS and an MR element formed on the element-forming surface, including a step of setting the magnetic head slider to be lapped on a lapping means, and a step of lapping by the lapping means the ABS of the magnetic head slider with while keeping an angle between the element-forming surface of the magnetic head slider and a lapping direction in a range greater than 0 degrees and equal to or less than 30 degrees.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: January 20, 2004
    Assignee: Sae Magnetics (H.K.) Ltd.
    Inventors: Osamu Fukuroi, Morihiro Ohno, Ryuji Fujii
  • Patent number: 6623330
    Abstract: A lapping sensor used in fabrication of a magnetic head with an MR element includes a resistor film with a resistance that varies depending upon a lapping amount, and a pair of connection pads formed on a element-forming surface of the magnetic head and electrically connected to both end sections of the resistor film. The pair of connection pads consist of a first connection pad and a second connection pad located nearer to a lapping surface than the first connection pad. One edge of the first connection pad is faced to one edge of the second connection pad and inclined toward the lapping surface.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: September 23, 2003
    Assignee: SAE Magnetics (H. K.) Ltd.
    Inventor: Osamu Fukuroi
  • Publication number: 20030162480
    Abstract: To provide a lapping apparatus and a lapping method that may effect further machining in response to each element on a ceramic bar to the ceramic bar that is largely locally lapped and may reduce a cost needed for machining without any jig for holding the ceramic bar.
    Type: Application
    Filed: December 16, 2002
    Publication date: August 28, 2003
    Inventors: Kazushige Tohta, Hiroshi Shindo, Akio Ogawa, Osamu Fukuroi, Takashi Fujii
  • Patent number: 6565414
    Abstract: In the polishing work for forming a crown shape on a ceramic bar bearing a plurality of conversion units for the magnetic heads, the present invention is to provide a well-controlled satisfactory shape by pressing the ceramic bar, provided with plural grooves perpendicular to the longitudinal direction and on a surface opposed to the polished plane, to a substantially concave polishing plane through an elastic member principally composed of rubber, then measuring the magneto resistivity of an element provided in the conversion unit of the magnetic head, and adjusting the pressure at the crown forming operation by a closed loop control based on the result of such measurement.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: May 20, 2003
    Assignee: TDK Corporation
    Inventors: Tetsuo Abe, Akio Ogawa, Tsugihiro Hasebe, Hiroshi Shindou, Osamu Fukuroi
  • Publication number: 20020170164
    Abstract: A method for shaping an ABS of a magnetic head slider includes a step of holding at least one row bar with a plurality of aligned thin-film magnetic head elements by adhering a first surface of the at least one row bar to an adhesive or UV tape capable of passing a laser beam there through, the first surface being opposite to an ABS of the at least one row bar, a step of shaping the ABS of the at least one row bar in a convex shape by radiating a laser beam to the first surface of the at least one row bar through the adhesive or UV tape, a step of cutting the at least one row bar into individual magnetic head sliders, and a step of then, removing the magnetic head sliders from the adhesive or UV tape after weakening adhesion properties of the adhesive or UV tape.
    Type: Application
    Filed: May 14, 2002
    Publication date: November 21, 2002
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventor: Osamu Fukuroi
  • Patent number: 6452750
    Abstract: A slider is provided that can implement a magnetic head reducing damage to a magnetic recording medium. The slider includes a body having a surface facing the magnetic recording medium and including at least one rail. The rail has at least one end that is chamfered into a concave curved surface.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: September 17, 2002
    Assignee: TDK Corporation
    Inventors: Osamu Fukuroi, Ryuji Fujii
  • Publication number: 20020119734
    Abstract: A lapping method of a magnetic head slider provided with an element-forming surface, an ABS and an MR element formed on the element-forming surface, includes a step of setting the magnetic head slider to be lapped on a lapping means, and a step of lapping by the lapping means the ABS of the magnetic head slider with keeping an angle between the element-forming surface of the magnetic head slider and a lapping direction in a range larger than 0 degree and equal to or smaller than 30 degrees.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 29, 2002
    Applicant: SAE Magnetics (H.K.) Ltd.,
    Inventors: Osamu Fukuroi, Morihiro Ohno, Ryuji Fujii
  • Publication number: 20020106974
    Abstract: A lapping sensor used in fabrication of a magnetic head with an MR element includes a resistor film with a resistance that varies depending upon a lapping amount, and a pair of connection pads formed on a element-forming surface of the magnetic head and electrically connected to both end sections of the resistor film. The pair of connection pads consist of a first connection pad and a second connection pad located nearer to a lapping surface than the first connection pad. One edge of the first connection pad is faced to one edge of the second connection pad and inclined toward the lapping surface.
    Type: Application
    Filed: February 8, 2002
    Publication date: August 8, 2002
    Inventor: Osamu Fukuroi
  • Publication number: 20020072298
    Abstract: In the polishing work for forming a crown shape on a ceramic bar bearing a plurality of conversion units for the magnetic heads, the present invention is to provide a well-controlled satisfactory shape by pressing the ceramic bar, provided with plural grooves perpendicular to the longitudinal direction and on a surface opposed to the polished plane, to a substantially concave polishing plane through an elastic member principally composed of rubber, then measuring the magneto resistivity of an element provided in the conversion unit of the magnetic head, and adjusting the pressure at the crown forming operation by a closed loop control based on the result of such measurement.
    Type: Application
    Filed: December 11, 2000
    Publication date: June 13, 2002
    Applicant: TDK CORPORATION
    Inventors: Tetsuo Abe, Akio Ogawa, Tsugihiro Hasebe, Hiroshi Shindou, Osamu Fukuroi
  • Patent number: 6399148
    Abstract: A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 &mgr;m or more.
    Type: Grant
    Filed: February 4, 2000
    Date of Patent: June 4, 2002
    Assignee: TDK Corporation
    Inventors: Osamu Fukuroi, Yoshiro Nakagawa
  • Patent number: 6398623
    Abstract: A working method capable of implementing various types of devices such as a slider available with high reliability without causing malfunction or the like due to contamination during an actual use is provided by solving a problem of deterioration in profile precision and a problem of contamination resulting from roughness of a cut surface or chipping. A wire saw comprising a wire having a diameter greater than a width of a portion cut by a first cutting step, namely, a width of a cut groove is brought into contact with the cut groove of a bar. While the wire saw is slid in a longitudinal direction, the bar is sliced across the overall thickness of the bar along the thickness of the bar. Thus, while the bar is cut, a final cut surface formed by cutting is smoothed.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: June 4, 2002
    Assignee: TDK Corporation
    Inventors: Osamu Fukuroi, Ryuji Fujii
  • Publication number: 20020001671
    Abstract: A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 &mgr;m or more.
    Type: Application
    Filed: February 4, 2000
    Publication date: January 3, 2002
    Inventors: Osamu Fukuroi, Yoshiro Nakagawa
  • Patent number: 6083081
    Abstract: A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 .mu.m or more.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: July 4, 2000
    Assignee: TDK Corporation
    Inventors: Osamu Fukuroi, Yoshiro Nakagawa