Abstract: An optical and electronic integrated switch includes a network processor that controls the functions of the packet switch, a plurality of optical transceivers having photoelectric conversion functions, and a plurality of optical switches. The optical switches include different types of optical core switch and a plurality of optical-path selection switches. The optical transceivers provided near the processor have a regenerative relay function that regenerates optical signals and turns back the optical signals, and perform optical communication with a communication counterpart via the optical switches. In the optical communication, optical switches of the different types can cooperate to set paths for optical cut-through in which path selection is performed such that inputted optical signals are outputted without the intervention of the processor. This optical cut-through can be effectively performed without imposing a signal processing burden that consumes electric power on the processor.

Abstract: A photonics-electronics convergence switch with which, even if an optical network system is built by combining a plurality of packet switches, the amount of processing in the packet switches does not increase, the optical network system operates with low electric power consumption, and this enables wide-range optical communication between the nodes of a communication origin and of a communication partner, includes a network processor that is an electronic circuit configured to control the functions of the packet switch, a plurality of optical transmitter-receivers having photoelectric conversion functions, and a plurality of optical switches.

Abstract: A resin composition of the present invention comprises: a silicone resin or a silicone oil (A), a compound (B) having a particular structure, and a thermally conductive filler (C). According to the present invention, a resin composition having favorable thermally conductive properties and exhibiting small physical property changes at high temperatures can be provided.

Abstract: There is provided a resin composition containing a resin component and diamond particles, the diamond particles having the total metal content constituted from iron, nickel, cobalt, and chromium of 5 ppm or higher and 300 ppm or lower.

Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.

Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.

Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.

Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.

Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.

Abstract: Provided is a resin material capable of effectively enhancing adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio of more than 2, and a binder resin, an absolute value of a difference between an average particle diameter of the first inorganic particles and an average major diameter of the second inorganic particles is 10 ?m or less, the average particle diameter of the first inorganic particles is 1 ?m or more and less than 20 ?m, the average major diameter of the second inorganic particles is 2 ?m or more, and the content of the second inorganic particles is more than 40% by volume relative to 100% by volume of sum of the first inorganic particles and the second inorganic particles.

Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.

Abstract: There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 ?m or less, the total thickness of the first metal material and the second metal material is 200 ?m or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.

Abstract: There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 ?m or less, the total thickness of the first metal material and the second metal material is 200 ?m or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.

Abstract: Provided is a photocurable and thermosetting adhesive for inkjet which can increase the thickness accuracy of an adhesive layer formed by curing an adhesive and can further cause the adhesive layer to hardly generate voids. A photocurable and thermosetting adhesive for inkjet according to the present invention contains a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermal curing agent, wherein the elastic modulus at 25° C. of a B-staged adhesive is at least 5.0×102 Pa and at most 8.0×104 Pa when the B-staged adhesive is obtained by irradiating the adhesive with light of a cumulative light quantity of 1000 mJ/cm2 so that illumination at a wavelength of 365 nm is 100 mW/cm2.

Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.

Abstract: The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more.

Abstract: Provided is an encapsulant for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulant when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. The encapsulant for optical semiconductor devices includes: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, but not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound having a titanium atom.

Abstract: The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity. The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound.

Abstract: The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity. The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound.

Abstract: The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.