Abstract: An electroless copper plating solution which can ensure superior adhesion of a copper plating film to a flat ceramic surface having low roughness and which can form a high-frequency electronic component having superior high-frequency conductivity and a high Q value is provided. Also provided is a high frequency electronic component formed by using this electroless copper plating solution. The electroless copper plating solution of contains copper ions, nickel ions, formaldehyde or a derivative thereof, and tartaric acid or a salt thereof. The ratio of the content of the nickel ions to that of the copper ions on a molar basis is in the range of about 0.0001 to 0.015.

Abstract: A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.

Abstract: An electroless copper plating solution which can ensure superior adhesion of a copper plating film to a flat ceramic surface having low roughness and which can form a high-frequency electronic component having superior high-frequency conductivity and a high Q value is provided. Also provided is a high frequency electronic component formed by using this electroless copper plating solution. The electroless copper plating solution of contains copper ions, nickel ions, formaldehyde or a derivative thereof, and tartaric acid or a salt thereof. The ratio of the content of the nickel ions to that of the copper ions on a molar basis is in the range of about 0.0001 to 0.015.

Abstract: A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.

Abstract: A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

Abstract: A method of manufacturing chip type electronic parts, comprises the steps of: applying a photo-active catalyst liquid to chip substrates to form a photo-sensitive film consisting of the photo-active catalyst liquid on the chip substrates; arranging the chip substrates with respect to a light source in a manner such that portions of the chip substrates on which electrodes are to be formed will become light irradiation portions; irradiating the chip substrates with a light so as to activate irradiated portions of the photo-sensitive film; dipping the chip substrates in an electroless plating bath and precipitating a plating metal on said activated portions.

Abstract: Inexpensive methods for producing small-sized monolithic electronic parts with improved functions by which an electroconductive film can be formed uniformly, thin, and in fine patterns on a ceramic green sheet, a carrier film, or a resin film, for example. A plurality of such ceramic green sheets, etc., each having the electroconductive film formed thereon, are laminated to give a ceramic laminate, which is then sintered. The electroconductive film is formed on each ceramic green sheet, etc.

Abstract: A hydrophilic activating catalytic solution for electroless plating is a mixture of lactate, palladium and alkaline medium. The solution enables depositing palladium catalyst in a short time radiation exposure and removing unwanted photo-sensitive film more effectively by water or the like. The lactate preferably comprises copper lactate and/or zinc lactate and the palladium salt is preferably palladium chloride.

Abstract: There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating catalytic solution for forming a photoreactive film on a base, forming the photoreactive film through the application of the activating catalytic solution, producing an activating catalyst by exposing particular regions of the photoreactive film, developing by flushing away the photoreactive film in unexposed regions, and immersing the base in an electroless plating bath without using an organic solvent and which allows the formation of a plating film having high electrical conductivity and high strength of adherence. A hydrophilic activating catalytic solution is used which is obtained by dissolving copper oxalate, a palladium salt such as palladium chloride into an alkaline solution such as ammonia.

Abstract: There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating catalytic solution for forming a photoreactive film on a base, forming the photoreactive film through the application of the activating catalytic solution, producing an activating catalyst by exposing particular regions of the photoreactive film, developing by flushing away the photoreactive film in unexposed regions, and immersing the base in an electroless plating bath without using an organic solvent and which allows the formation of a plating film having high electrical conductivity and high strength of adherence. A hydrophilic activating catalytic solution is used which is obtained by dissolving copper oxalate, a palladium salt such as palladium chloride into an alkaline solution such as ammonia.

Abstract: Disclosed is an activating catalytic solution for electroless plating which makes possible carrying out successive processes efficiently, without using organic solvent, involving preparation of activating catalytic solution for forming substrate film, formation of a photo-sensitive film by providing the activating catalytic solution, creation of activating catalyst by exposure of specific areas of the photo-sensitive film to light, development by rinsing unexposed portions of the photo-sensitive film, and immersion of the substrate in an electroless plating bath. The activating catalyst can be created with high sensitivity to light at small energy of radiation. The activating catalytic solution preferably contains zinc oxalate, a copper salt, palladium salt such as palladium chloride, and an alkaline solution such as an ammonia water. The activating catalytic solution is used for forming a photo-sensitive film on a substrate to be subjected to electroless plating.

Abstract: A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

Abstract: A high-frequency inductor comprising an insulating substrate; and a conductive land formed on the insulating substrate, the conductive land comprising at least two thin films formed of different compositions of metals, each of the metals is to be etched by such an etching agent that substantially never removes the other metals, the thin films being accumulated vertically.

Abstract: A corrosion inhibiting coating for a metal surface, especially useful for electrical conductors, where the surface of the metal is covered with an organic corrosion inhibitor and an exterior layer of an inactive fluoric material thereon.