Abstract: A method of adjusting a semiconductor pressure switch of the type having a silicon substrate having a pressure receiving diaphragm includes mounting and pressurizing the semiconductor pressure switch in a pressure chamber and measuring the pressure of the switch to determine if the pressure is above or below the predetermined pressure detection value. If the measured pressure is above the predetermined pressure detection value, the thickness of the diaphragm is adjusted by thinning the diaphragm to adjust the measured pressure to the predetermined pressure detection value. If the measured pressure is below the predetermined pressure detection value, the thickness of the diaphragm is adjusted by thickenning the diaphragm to adjust the measured pressure to the predetermined pressure detection value.

Abstract: Herein disclosed is a film forming apparatus, in which a magnet for generng the lines of magnetic force generally at a right angle with respect to opposed cathodes is disposed at one of the cathodes to shorten the distance from a passage hole through a conduit to an object by the thickness of the magnet, thereby to pass metal particles efficiently. At the same time, a holed plate is supported elastically and in close contact with the object to form a film contouring the shape of the hole of the holed plate correctly. Moreover, the holed plate is made thinner than its diameter to permit sufficient passage of the metal particles through the hole of the holed plate thereby to form a film efficiently. In the film forming apparatus of the present invention, moreover, the magnet of the vacuum chamber at the side of the conduit of the prior art can be dispensed with to make unnecessary the drilling of the magnet and to reduce the number of parts.

Abstract: A method of correcting a missing defect of a patterned film formed on an icle is carried out by steps of providing an operative vacuum chamber having a pin hole, positioning an area of the missing defect outside the vacuum chamber in registration with the pin hole, operating the vacuum chamber to cause therein cold cathode discharging to generate particles, and directing a stream of the particles through the pin hole onto the area of the missing defect to deposit thereon a corrective film of the particles.