Patents by Inventor Osamu Kurosu

Osamu Kurosu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6377064
    Abstract: An IC device to be inspected is received in a chamber, and an IC tester Judges performance of the IC device. An electrical connection device is arranged outside the chamber and has a conductive passage electrically connecting between the IC tester and the IC device. An IC socket is retained on the electrical connection device, for having the IC device inserted therein. A magnetometric sensor is arranged close to the conductive passage of the electrical connection device, for detecting a magnetic field generated when electric current is supplied to the IC device. A temperature control device controls a temperature of the IC device. A control unit controls the temperature control device based on a signal delivered from the magnetometric sensor, to maintain the temperature of the IC device within a predetermined temperature range.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: April 23, 2002
    Assignees: NEC Corporation, Y.A.C. Co., Ltd.
    Inventors: Osamu Kurosu, Kazuhiro Kawaguchi, Kazuya Tsujino, Yasuyuki Takata, Keisuke Yoshida
  • Patent number: 6262584
    Abstract: An IC device temperature control system is provided which includes a magnetometric sensor that detects a magnetic field generated around an IC device received in a chamber for inspection when electric current is supplied to the IC device, and a converter that converts an output signal from the magnetometric sensor to information indicative of an amount of heat generated by the IC device. A temperature control device controls a temperature of the IC device, and a control unit controls the temperature control device to maintain the temperature of the IC device within a predetermined range based on the information indicative of the amount of heat generated by the IC device.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: July 17, 2001
    Assignee: McElectronics Co., Ltd.
    Inventors: Osamu Kurosu, Kazuhiro Kawaguchi