Abstract: A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.

Abstract: A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5° or less, can provide a high wiring density and signal transmission performance.

Abstract: A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes.

Abstract: A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

Abstract: A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.

Abstract: An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

Abstract: A composite of metal and an organic film having a high adhesiveness without deterioration of film quality is provided by exposing the surface of organic film to at least one of chemically reactive gas phase molecules and gas phase ions thereby forming functional groups on the surface of organic film, and forming a metallic film thereon through the functional groups.

Abstract: Object: An object of the present invention is to provide a damper absorbing a rotary power around its axis, which has a construction to make the damper compact for mounting at a narrow position, which can be applied to cause a highly damped torque.

Abstract: The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

Abstract: The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

Abstract: A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

Abstract: A one-way damper comprising a cylindrical outer frame 10 with one end closed within which is provided a cylindrical inner frame 20 in a state rotatable relative thereto, packing material G packed between said inner and outer frames, and when a relative rotation being caused between said both inner and outer frames the rotation of said frame of one side may be capable of giving resistance to the rotation of said frame of other side, and inside of said inner frame 20 being provided with a mechanism which may perform meshing and removal according to a direction of rotation of a rotary shaft 50 for effecting transmission and non-transmission of torque from said rotary shaft 50 to said inner frame 20.

Abstract: In a process for forming a wiring conductor of Cu, Al, Au or the like on a wiring substrate, polyimide-based resin having the following unit structural formula is used as a lift-off material. ##STR1## wherein R.sub.1 : ##STR2## R.sub.2 : ##STR3## n is an integer of 15,000 to 30,000. This lift-off material has very good etching susceptibility and can be selectively lifted off with an etching solution of a mixture of hydrazine and ethylene diamine from a lower polyimide layer having R.sub.1 : ##STR4## R.sub.2 : ##STR5## .

Abstract: A one way clutch includes a tubular outer drive member formed of a thermoplastic resin and integrally formed with a torque transmitting member such as a gear or hand lever, a metal sleeve with a polygonal inside face located in the bore of and rotatable with the outer drive member, an integrally formed thermoplastic resin cage member projecting into the sleeve and having retainer spaces holding rollers engagable with respective sleeve polygonal faces, a coaxial shaft engaging the rollers which are spring biased to release positions in the wedge spaces delineated by the confronting shaft and sleeve surfaces and snap fastening means integrally formed with the cage and outer drive members locking the clutch in assembled condition.

Abstract: Apparatus for preparing a cup of hot drink includes a hot water supply device and a powder supply device. The hot water supply device comprises a tank for storing the hot water, a member for controlling the temperature of the hot water in the tank, valve means for controlling the pressure of the hot water, a pipe for feeding the hot water and valve means for controlling the amount of the hot water to be fed. The powder supply device comprises a hopper filled with the powder, a powder measuring device connected to the bottom of the hopper, a chute connected to the bottom of the powder measuring device, and a table on which a cup is placed so that the hot water is poured eccentrically from the center of the cup. The powder measuring device comprises a two-stage shutter mechanism.