Patents by Inventor Osamu Moriya
Osamu Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230120688Abstract: A magnetic component is configured to be used with a coil wound about a center axis along an axis direction. A first magnetic member is configured such that magnetic flux generated by the coil passes therethrough, extends in the axis direction to have first and second ends, and has a portion overlapping with the coil viewed perpendicular to the axis direction. A second magnetic member is disposed on an opposite side to the coil with respect to the first end of the first magnetic member, in the axis direction. A third magnetic member is disposed on an opposite side to the coil with respect to the second magnetic member, in the axis direction. The third magnetic member is larger in magnetic anisotropy than each of the first magnetic member and the second magnetic member, and has an easy direction of magnetization oriented perpendicular to the axis direction.Type: ApplicationFiled: February 4, 2021Publication date: April 20, 2023Inventors: Junichi KOTANI, Osamu MORIYA, Kanako SUGIMURA
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Patent number: 11581129Abstract: A reactor includes a plurality of windings, a coupling core, and an inductor core. A coupling core configured to form a coupling closed magnetic circuit that magnetically couples the plurality of windings, the plurality of windings being wound around the coupling core; and. An inductor core, which includes a main part, a first projection part projecting from one end of the main part, and a second projection part projecting from another end of the main part, and each of the first projection part and the second projection part is magnetically connected to the coupling core. The inductor core forms an inductor closed magnetic circuit together with a part of the coupling core around which one winding of the plurality of windings is wound.Type: GrantFiled: March 15, 2018Date of Patent: February 14, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Junichi Kotani, Hisayoshi Kato, Takayuki Hiruma, Osamu Moriya
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Patent number: 11371616Abstract: A mechanical seal capable of eliminating the need for an elastic body includes a metallic sleeve 120 fixed to a rotary shaft 500 and a metallic rotary ring 110 fixed to the sleeve 120. A metallic cartridge 220 is fixed to a housing 600. A metallic fixed ring 210 is configured to slide on an end surface of the rotary ring 110. A metallic bellows 230 presses the fixed ring 210 toward the rotary ring 110, wherein the rotary ring 110 and the sleeve 120 are connected to each other by an annular first connecting part, whereby a radially inner side region and a radially outer side region are separated from each other, one end of the bellows 230 and the fixed ring 210 are connected to each other by an annular second connecting part.Type: GrantFiled: May 8, 2018Date of Patent: June 28, 2022Assignee: EAGLE INDUSTRY CO., LTD.Inventors: Osamu Moriya, Koji Sato
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Publication number: 20220189687Abstract: A leakage transformer includes a core and a printed wiring board. The core includes a first magnetic leg and a second magnetic leg. The second magnetic leg is spaced from the first magnetic leg. The printed wiring board includes an insulating portion and conductor wiring. The conductor wiring includes a first coil and a second coil. The first coil is formed of a first winding and is wound around only the first magnetic leg, not around the second magnetic leg. The second coil is formed of a second winding and includes a first part and a second part. The first part is wound around only the first magnetic leg, not around the second magnetic leg. The second part is wound around both the first and second magnetic legs.Type: ApplicationFiled: March 13, 2020Publication date: June 16, 2022Inventors: Junichi KOTANI, Osamu MORIYA, Hisayoshi KATO, Toshiyuki ASAHI
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Patent number: 11187326Abstract: A mechanical seal in which a rotary ring can be more reliably positioned. A rotary ring unit 100 includes: a sleeve 120 fixed to a rotary shaft 500; and a rotary ring 110 of which a movement in an axial direction and a rotation with respect to the sleeve 120 is restricted, a fixed ring unit 200 includes: a fixed ring 210 configured to slide on an end surface of the rotary ring 110; and a bellows 250 which presses the fixed ring 210 toward the rotary ring 110, and the sleeve 120 is provided with a stopper 140 which restricts a movement of the rotary ring 110 toward the fixed ring 210.Type: GrantFiled: May 8, 2018Date of Patent: November 30, 2021Assignee: EAGLE INDUSTRY CO., LTD.Inventors: Osamu Moriya, Akira Yoshino
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Publication number: 20210110970Abstract: A reactor includes a plurality of windings, a coupling core, and an inductor core. A coupling core configured to form a coupling closed magnetic circuit that magnetically couples the plurality of windings, the plurality of windings being wound around the coupling core; and. An inductor core, which includes a main part, a first projection part projecting from one end of the main part, and a second projection part projecting from another end of the main part, and each of the first projection part and the second projection part is magnetically connected to the coupling core. The inductor core forms an inductor closed magnetic circuit together with a part of the coupling core around which one winding of the plurality of windings is wound.Type: ApplicationFiled: March 15, 2018Publication date: April 15, 2021Inventors: Junichi KOTANI, Hisayoshi KATO, Takayuki HIRUMA, Osamu MORIYA
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Publication number: 20200200275Abstract: A mechanical seal in which a rotary ring can be more reliably positioned. A rotary ring unit 100 includes: a sleeve 120 fixed to a rotary shaft 500; and a rotary ring 110 of which a movement in an axial direction and a rotation with respect to the sleeve 120 is restricted, a fixed ring unit 200 includes: a fixed ring 210 configured to slide on an end surface of the rotary ring 110; and a bellows 250 which presses the fixed ring 210 toward the rotary ring 110, and the sleeve 120 is provided with a stopper 140 which restricts a movement of the rotary ring 110 toward the fixed ring 210.Type: ApplicationFiled: May 8, 2018Publication date: June 25, 2020Inventors: Osamu MORIYA, Akira YOSHINO
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Publication number: 20200166141Abstract: A mechanical seal capable of eliminating the need for an elastic body includes a metallic sleeve 120 fixed to a rotary shaft 500 and a metallic rotary ring 110 fixed to the sleeve 120. A metallic cartridge 220 is fixed to a housing 600. A metallic fixed ring 210 is configured to slide on an end surface of the rotary ring 110. A metallic bellows 230 presses the fixed ring 210 toward the rotary ring 110, wherein the rotary ring 110 and the sleeve 120 are connected to each other by an annular first connecting part, whereby a radially inner side region and a radially outer side region are separated from each other, one end of the bellows 230 and the fixed ring 210 are connected to each other by an annular second connecting part.Type: ApplicationFiled: May 8, 2018Publication date: May 28, 2020Inventors: Osamu MORIYA, Koji SATO
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Patent number: 10224291Abstract: A high frequency semiconductor device package includes a metal plate, a frame body, a first lead part, a second lead part, a first conductive layer, and a second conductive layer. The frame body includes a first frame part made and a second frame part. The first frame part has a lower surface bonded to the metal plate. The first frame part has an upper surface including a first region and a second region. The first lead part protrudes outward along a line passing through a central part of the first region and a central part of the second region in plan view. The second lead part protrudes outward along the line in plan view. The first conductive layer includes a first stripe part and a first connection part. The second conductive layer includes a second stripe part and a second connection part.Type: GrantFiled: January 17, 2017Date of Patent: March 5, 2019Assignee: Kabushiki Kaisha ToshibaInventors: Osamu Moriya, Tomohiro Senju
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Patent number: 9887676Abstract: A high frequency semiconductor amplifier includes a package base part, and a monolithic microwave integrated circuit. The package base part includes a metal plate provided with an attachment hole, a frame body bonded to the metal plate and provided with an opening, a first lead part, and a second lead part. The monolithic microwave integrated circuit is provided with a first amplification element and a second amplification element. An output electrode of the second amplification element is connected to the second lead part via an output combiner. Each finger electrode of the second amplification element is generally orthogonal to the first line. Each finger electrode of the first amplification element is generally parallel to the first line. The attachment hole of the metal plate is provided in a region lying along a second line generally orthogonal to the first line and protruding outside the frame body.Type: GrantFiled: January 17, 2017Date of Patent: February 6, 2018Assignee: Kabushiki Kaisha ToshibaInventors: Osamu Moriya, Tomohiro Senju
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Publication number: 20170373652Abstract: A high frequency semiconductor amplifier includes a package base part, and a monolithic microwave integrated circuit. The package base part includes a metal plate provided with an attachment hole, a frame body bonded to the metal plate and provided with an opening, a first lead part, and a second lead part. The monolithic microwave integrated circuit is provided with a first amplification element and a second amplification element. An output electrode of the second amplification element is connected to the second lead part via an output combiner. Each finger electrode of the second amplification element is generally orthogonal to the first line. Each finger electrode of the first amplification element is generally parallel to the first line. The attachment hole of the metal plate is provided in a region lying along a second line generally orthogonal to the first line and protruding outside the frame body.Type: ApplicationFiled: January 17, 2017Publication date: December 28, 2017Applicant: Kabushiki Kaisha ToshibaInventors: Osamu MORIYA, Tomohiro SENJU
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Publication number: 20170373017Abstract: A high frequency semiconductor device package includes a metal plate, a frame body, a first lead part, a second lead part, a first conductive layer, and a second conductive layer. The frame body includes a first frame part made and a second frame part. The first frame part has a lower surface bonded to the metal plate. The first frame part has an upper surface including a first region and a second region. The first lead part protrudes outward along a line passing through a central part of the first region and a central part of the second region in plan view. The second lead part protrudes outward along the line in plan view. The first conductive layer includes a first stripe part and a first connection part. The second conductive layer includes a second stripe part and a second connection part.Type: ApplicationFiled: January 17, 2017Publication date: December 28, 2017Applicant: Kabushiki Kaisha ToshibaInventors: Osamu MORIYA, Tomohiro SENJU
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Patent number: 8531819Abstract: A solid electrolytic capacitor includes a capacitor element, a conductive member, an electrical insulating member, and a tubular member. The element has an element body with a cathode layer, and an anode lead. The conductive member is placed to face a first end surface of the body through which the lead is pulled out. The electrical insulating member is placed between the conductive member and the body. The lead passes through a through hole defined in the electrical insulating member. A tip end portion of the lead is inserted into a through hole or a closed end hole defined in the conductive member to be electrically connected to the conductive member. Insertion of the body into the tubular member causes the tubular member to cover at least part of a side surface of the body, while making electrical connection between the tubular member and the cathode layer.Type: GrantFiled: May 6, 2011Date of Patent: September 10, 2013Assignee: SANYO Electric Co., Ltd.Inventors: Osamu Moriya, Kazuya Niki, Hiroya Nishimoto
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Patent number: 8470953Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.Type: GrantFiled: August 1, 2011Date of Patent: June 25, 2013Assignee: Lintec CorporationInventors: Mikihiro Kashio, Toshio Sugizaki, Osamu Moriya
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Patent number: 8098478Abstract: An electric element includes a dielectric layers, conductive plates, anode electrodes, and cathode electrodes. The conductive plates and the conductive plates are alternately laminated in the width direction of the electric element. The anode electrodes are connected to each of the conductive plates with a predetermined distance. The cathode electrodes are connected to each of the conductive plates with a predetermined distance. The electric element is mounted on a substrate in a manner where the bottom surface makes contact with the substrate. The anode electrode is connected to a first signal line that has a width substantially equal to that of the electric element disposed on the substrate. The anode electrode is connected to a second signal line that has a width substantially equal to that of the electric element disposed on the substrate.Type: GrantFiled: June 27, 2007Date of Patent: January 17, 2012Assignee: SANYO Electric Co., Ltd.Inventors: Kazuya Niki, Osamu Moriya, Shingo Maeda
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Patent number: 8080604Abstract: An adhesive containing a ladder-type polysilsesquioxane which firmly bonds metals and synthetic resins and an adhesive sheet having an adhesive layer formed by using the adhesive on at least one side of a substrate are provided. An adhesive comprises a ladder-type polysilsesquioxane having a recurring unit of the following formula (I) in the molecule, wherein R1 represents a polymerizable functional group, and R2 represents the same group as R1, an alkyl group having 1 to 6 carbon atoms which may have a substituent, an alkoxy group having 1 to 6 carbon atoms which may have a substituent, or a phenyl group which may have a substituent, and the adhesive sheet has an adhesive layer formed by using the adhesive on at least one side of the substrate.Type: GrantFiled: February 28, 2008Date of Patent: December 20, 2011Assignee: Lintec CorporationInventors: Shiori Beppu, Mikihiro Kashio, Toshio Sugizaki, Toshifumi Kageyama, Osamu Moriya
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Publication number: 20110288257Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.Type: ApplicationFiled: August 1, 2011Publication date: November 24, 2011Inventors: Mikihiro KASHIO, Toshio Sugizaki, Osamu Moriya
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Publication number: 20110273816Abstract: A solid electrolytic capacitor includes a capacitor element, a conductive member, an electrical insulating member, and a tubular member. The element has an element body with a cathode layer, and an anode lead. The conductive member is placed to face a first end surface of the body through which the lead is pulled out. The electrical insulating member is placed between the conductive member and the body. The lead passes through a through hole defined in the electrical insulating member. A tip end portion of the lead is inserted into a through hole or a closed end hole defined in the conductive member to be electrically connected to the conductive member. Insertion of the body into the tubular member causes the tubular member to cover at least part of a side surface of the body, while making electrical connection between the tubular member and the cathode layer.Type: ApplicationFiled: May 6, 2011Publication date: November 10, 2011Applicant: SANYO ELECTRIC CO., LTD.Inventors: Osamu Moriya, Kazuya Niki, Hiroya Nishimoto
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Patent number: 8026332Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.Type: GrantFiled: March 18, 2008Date of Patent: September 27, 2011Assignee: Lintec CorporationInventors: Mikihiro Kashio, Toshio Sugizaki, Osamu Moriya
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Patent number: 7759406Abstract: The present invention provides a process for producing a polysilsesquioxane graft polymer (1) which includes applying ionizing radiation or heat to a mixture including a polysilsesquioxane compound (2) and a vinyl compound (3), a polysilsesquioxane compound including an iniferter group, and a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet using the polymer. According to the present invention, a process for producing a polysilsesquioxane graft polymer which may be used as a pressure-sensitive adhesive exhibiting excellent heat resistance and cohesive force, and the like are provided. In the formula, A represents a linking group, R1 represents a hydrocarbon group which may have a substituent, R2 represents a hydrogen atom or the like, R3 represents a polar group or the like, R4 represents a hydrogen atom or the like, k1 to k3 represent arbitrary positive integers, 1 to n represent zero or an arbitrary positive integer (excluding the case where “m=n=0”), and Q represents an iniferter group.Type: GrantFiled: September 22, 2004Date of Patent: July 20, 2010Assignee: Lintec CorporationInventors: Taketo Kumon, Toshifumi Kageyama, Atsuko Kimura, Toshio Sugizaki, Osamu Moriya