Patents by Inventor Osamu Moriya

Osamu Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230120688
    Abstract: A magnetic component is configured to be used with a coil wound about a center axis along an axis direction. A first magnetic member is configured such that magnetic flux generated by the coil passes therethrough, extends in the axis direction to have first and second ends, and has a portion overlapping with the coil viewed perpendicular to the axis direction. A second magnetic member is disposed on an opposite side to the coil with respect to the first end of the first magnetic member, in the axis direction. A third magnetic member is disposed on an opposite side to the coil with respect to the second magnetic member, in the axis direction. The third magnetic member is larger in magnetic anisotropy than each of the first magnetic member and the second magnetic member, and has an easy direction of magnetization oriented perpendicular to the axis direction.
    Type: Application
    Filed: February 4, 2021
    Publication date: April 20, 2023
    Inventors: Junichi KOTANI, Osamu MORIYA, Kanako SUGIMURA
  • Patent number: 11581129
    Abstract: A reactor includes a plurality of windings, a coupling core, and an inductor core. A coupling core configured to form a coupling closed magnetic circuit that magnetically couples the plurality of windings, the plurality of windings being wound around the coupling core; and. An inductor core, which includes a main part, a first projection part projecting from one end of the main part, and a second projection part projecting from another end of the main part, and each of the first projection part and the second projection part is magnetically connected to the coupling core. The inductor core forms an inductor closed magnetic circuit together with a part of the coupling core around which one winding of the plurality of windings is wound.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: February 14, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Junichi Kotani, Hisayoshi Kato, Takayuki Hiruma, Osamu Moriya
  • Patent number: 11371616
    Abstract: A mechanical seal capable of eliminating the need for an elastic body includes a metallic sleeve 120 fixed to a rotary shaft 500 and a metallic rotary ring 110 fixed to the sleeve 120. A metallic cartridge 220 is fixed to a housing 600. A metallic fixed ring 210 is configured to slide on an end surface of the rotary ring 110. A metallic bellows 230 presses the fixed ring 210 toward the rotary ring 110, wherein the rotary ring 110 and the sleeve 120 are connected to each other by an annular first connecting part, whereby a radially inner side region and a radially outer side region are separated from each other, one end of the bellows 230 and the fixed ring 210 are connected to each other by an annular second connecting part.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: June 28, 2022
    Assignee: EAGLE INDUSTRY CO., LTD.
    Inventors: Osamu Moriya, Koji Sato
  • Publication number: 20220189687
    Abstract: A leakage transformer includes a core and a printed wiring board. The core includes a first magnetic leg and a second magnetic leg. The second magnetic leg is spaced from the first magnetic leg. The printed wiring board includes an insulating portion and conductor wiring. The conductor wiring includes a first coil and a second coil. The first coil is formed of a first winding and is wound around only the first magnetic leg, not around the second magnetic leg. The second coil is formed of a second winding and includes a first part and a second part. The first part is wound around only the first magnetic leg, not around the second magnetic leg. The second part is wound around both the first and second magnetic legs.
    Type: Application
    Filed: March 13, 2020
    Publication date: June 16, 2022
    Inventors: Junichi KOTANI, Osamu MORIYA, Hisayoshi KATO, Toshiyuki ASAHI
  • Patent number: 11187326
    Abstract: A mechanical seal in which a rotary ring can be more reliably positioned. A rotary ring unit 100 includes: a sleeve 120 fixed to a rotary shaft 500; and a rotary ring 110 of which a movement in an axial direction and a rotation with respect to the sleeve 120 is restricted, a fixed ring unit 200 includes: a fixed ring 210 configured to slide on an end surface of the rotary ring 110; and a bellows 250 which presses the fixed ring 210 toward the rotary ring 110, and the sleeve 120 is provided with a stopper 140 which restricts a movement of the rotary ring 110 toward the fixed ring 210.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: November 30, 2021
    Assignee: EAGLE INDUSTRY CO., LTD.
    Inventors: Osamu Moriya, Akira Yoshino
  • Publication number: 20210110970
    Abstract: A reactor includes a plurality of windings, a coupling core, and an inductor core. A coupling core configured to form a coupling closed magnetic circuit that magnetically couples the plurality of windings, the plurality of windings being wound around the coupling core; and. An inductor core, which includes a main part, a first projection part projecting from one end of the main part, and a second projection part projecting from another end of the main part, and each of the first projection part and the second projection part is magnetically connected to the coupling core. The inductor core forms an inductor closed magnetic circuit together with a part of the coupling core around which one winding of the plurality of windings is wound.
    Type: Application
    Filed: March 15, 2018
    Publication date: April 15, 2021
    Inventors: Junichi KOTANI, Hisayoshi KATO, Takayuki HIRUMA, Osamu MORIYA
  • Publication number: 20200200275
    Abstract: A mechanical seal in which a rotary ring can be more reliably positioned. A rotary ring unit 100 includes: a sleeve 120 fixed to a rotary shaft 500; and a rotary ring 110 of which a movement in an axial direction and a rotation with respect to the sleeve 120 is restricted, a fixed ring unit 200 includes: a fixed ring 210 configured to slide on an end surface of the rotary ring 110; and a bellows 250 which presses the fixed ring 210 toward the rotary ring 110, and the sleeve 120 is provided with a stopper 140 which restricts a movement of the rotary ring 110 toward the fixed ring 210.
    Type: Application
    Filed: May 8, 2018
    Publication date: June 25, 2020
    Inventors: Osamu MORIYA, Akira YOSHINO
  • Publication number: 20200166141
    Abstract: A mechanical seal capable of eliminating the need for an elastic body includes a metallic sleeve 120 fixed to a rotary shaft 500 and a metallic rotary ring 110 fixed to the sleeve 120. A metallic cartridge 220 is fixed to a housing 600. A metallic fixed ring 210 is configured to slide on an end surface of the rotary ring 110. A metallic bellows 230 presses the fixed ring 210 toward the rotary ring 110, wherein the rotary ring 110 and the sleeve 120 are connected to each other by an annular first connecting part, whereby a radially inner side region and a radially outer side region are separated from each other, one end of the bellows 230 and the fixed ring 210 are connected to each other by an annular second connecting part.
    Type: Application
    Filed: May 8, 2018
    Publication date: May 28, 2020
    Inventors: Osamu MORIYA, Koji SATO
  • Patent number: 10224291
    Abstract: A high frequency semiconductor device package includes a metal plate, a frame body, a first lead part, a second lead part, a first conductive layer, and a second conductive layer. The frame body includes a first frame part made and a second frame part. The first frame part has a lower surface bonded to the metal plate. The first frame part has an upper surface including a first region and a second region. The first lead part protrudes outward along a line passing through a central part of the first region and a central part of the second region in plan view. The second lead part protrudes outward along the line in plan view. The first conductive layer includes a first stripe part and a first connection part. The second conductive layer includes a second stripe part and a second connection part.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: March 5, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Moriya, Tomohiro Senju
  • Patent number: 9887676
    Abstract: A high frequency semiconductor amplifier includes a package base part, and a monolithic microwave integrated circuit. The package base part includes a metal plate provided with an attachment hole, a frame body bonded to the metal plate and provided with an opening, a first lead part, and a second lead part. The monolithic microwave integrated circuit is provided with a first amplification element and a second amplification element. An output electrode of the second amplification element is connected to the second lead part via an output combiner. Each finger electrode of the second amplification element is generally orthogonal to the first line. Each finger electrode of the first amplification element is generally parallel to the first line. The attachment hole of the metal plate is provided in a region lying along a second line generally orthogonal to the first line and protruding outside the frame body.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: February 6, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Moriya, Tomohiro Senju
  • Publication number: 20170373652
    Abstract: A high frequency semiconductor amplifier includes a package base part, and a monolithic microwave integrated circuit. The package base part includes a metal plate provided with an attachment hole, a frame body bonded to the metal plate and provided with an opening, a first lead part, and a second lead part. The monolithic microwave integrated circuit is provided with a first amplification element and a second amplification element. An output electrode of the second amplification element is connected to the second lead part via an output combiner. Each finger electrode of the second amplification element is generally orthogonal to the first line. Each finger electrode of the first amplification element is generally parallel to the first line. The attachment hole of the metal plate is provided in a region lying along a second line generally orthogonal to the first line and protruding outside the frame body.
    Type: Application
    Filed: January 17, 2017
    Publication date: December 28, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu MORIYA, Tomohiro SENJU
  • Publication number: 20170373017
    Abstract: A high frequency semiconductor device package includes a metal plate, a frame body, a first lead part, a second lead part, a first conductive layer, and a second conductive layer. The frame body includes a first frame part made and a second frame part. The first frame part has a lower surface bonded to the metal plate. The first frame part has an upper surface including a first region and a second region. The first lead part protrudes outward along a line passing through a central part of the first region and a central part of the second region in plan view. The second lead part protrudes outward along the line in plan view. The first conductive layer includes a first stripe part and a first connection part. The second conductive layer includes a second stripe part and a second connection part.
    Type: Application
    Filed: January 17, 2017
    Publication date: December 28, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu MORIYA, Tomohiro SENJU
  • Patent number: 8531819
    Abstract: A solid electrolytic capacitor includes a capacitor element, a conductive member, an electrical insulating member, and a tubular member. The element has an element body with a cathode layer, and an anode lead. The conductive member is placed to face a first end surface of the body through which the lead is pulled out. The electrical insulating member is placed between the conductive member and the body. The lead passes through a through hole defined in the electrical insulating member. A tip end portion of the lead is inserted into a through hole or a closed end hole defined in the conductive member to be electrically connected to the conductive member. Insertion of the body into the tubular member causes the tubular member to cover at least part of a side surface of the body, while making electrical connection between the tubular member and the cathode layer.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: September 10, 2013
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Osamu Moriya, Kazuya Niki, Hiroya Nishimoto
  • Patent number: 8470953
    Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: June 25, 2013
    Assignee: Lintec Corporation
    Inventors: Mikihiro Kashio, Toshio Sugizaki, Osamu Moriya
  • Patent number: 8098478
    Abstract: An electric element includes a dielectric layers, conductive plates, anode electrodes, and cathode electrodes. The conductive plates and the conductive plates are alternately laminated in the width direction of the electric element. The anode electrodes are connected to each of the conductive plates with a predetermined distance. The cathode electrodes are connected to each of the conductive plates with a predetermined distance. The electric element is mounted on a substrate in a manner where the bottom surface makes contact with the substrate. The anode electrode is connected to a first signal line that has a width substantially equal to that of the electric element disposed on the substrate. The anode electrode is connected to a second signal line that has a width substantially equal to that of the electric element disposed on the substrate.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: January 17, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Kazuya Niki, Osamu Moriya, Shingo Maeda
  • Patent number: 8080604
    Abstract: An adhesive containing a ladder-type polysilsesquioxane which firmly bonds metals and synthetic resins and an adhesive sheet having an adhesive layer formed by using the adhesive on at least one side of a substrate are provided. An adhesive comprises a ladder-type polysilsesquioxane having a recurring unit of the following formula (I) in the molecule, wherein R1 represents a polymerizable functional group, and R2 represents the same group as R1, an alkyl group having 1 to 6 carbon atoms which may have a substituent, an alkoxy group having 1 to 6 carbon atoms which may have a substituent, or a phenyl group which may have a substituent, and the adhesive sheet has an adhesive layer formed by using the adhesive on at least one side of the substrate.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: December 20, 2011
    Assignee: Lintec Corporation
    Inventors: Shiori Beppu, Mikihiro Kashio, Toshio Sugizaki, Toshifumi Kageyama, Osamu Moriya
  • Publication number: 20110288257
    Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.
    Type: Application
    Filed: August 1, 2011
    Publication date: November 24, 2011
    Inventors: Mikihiro KASHIO, Toshio Sugizaki, Osamu Moriya
  • Publication number: 20110273816
    Abstract: A solid electrolytic capacitor includes a capacitor element, a conductive member, an electrical insulating member, and a tubular member. The element has an element body with a cathode layer, and an anode lead. The conductive member is placed to face a first end surface of the body through which the lead is pulled out. The electrical insulating member is placed between the conductive member and the body. The lead passes through a through hole defined in the electrical insulating member. A tip end portion of the lead is inserted into a through hole or a closed end hole defined in the conductive member to be electrically connected to the conductive member. Insertion of the body into the tubular member causes the tubular member to cover at least part of a side surface of the body, while making electrical connection between the tubular member and the cathode layer.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 10, 2011
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Osamu Moriya, Kazuya Niki, Hiroya Nishimoto
  • Patent number: 8026332
    Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: September 27, 2011
    Assignee: Lintec Corporation
    Inventors: Mikihiro Kashio, Toshio Sugizaki, Osamu Moriya
  • Patent number: 7759406
    Abstract: The present invention provides a process for producing a polysilsesquioxane graft polymer (1) which includes applying ionizing radiation or heat to a mixture including a polysilsesquioxane compound (2) and a vinyl compound (3), a polysilsesquioxane compound including an iniferter group, and a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet using the polymer. According to the present invention, a process for producing a polysilsesquioxane graft polymer which may be used as a pressure-sensitive adhesive exhibiting excellent heat resistance and cohesive force, and the like are provided. In the formula, A represents a linking group, R1 represents a hydrocarbon group which may have a substituent, R2 represents a hydrogen atom or the like, R3 represents a polar group or the like, R4 represents a hydrogen atom or the like, k1 to k3 represent arbitrary positive integers, 1 to n represent zero or an arbitrary positive integer (excluding the case where “m=n=0”), and Q represents an iniferter group.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: July 20, 2010
    Assignee: Lintec Corporation
    Inventors: Taketo Kumon, Toshifumi Kageyama, Atsuko Kimura, Toshio Sugizaki, Osamu Moriya