Patents by Inventor Osamu Munekata
Osamu Munekata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11712760Abstract: In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.Type: GrantFiled: March 19, 2021Date of Patent: August 1, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Naoto Kameda, Masato Tsuchiya, Katsuji Nakamura, Osamu Munekata, Kaichi Tsuruta
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Publication number: 20230094946Abstract: Provided are a metal body that can be manufactured easily while whisker generation resulting from external stress is suppressed, a fitting connection terminal, and a method for forming the metal body. The metal body includes a barrier layer containing Ni as a main component formed on a metal substrate containing Cu as a main component, and a metal plating layer containing Sn as a main component formed directly on the barrier layer. An area ratio that is a ratio of the area of an intermetallic compound containing Sn and Cu in the metal plating layer to a cross section of the metal plating layer is 20% or less in the cross section of the metal body.Type: ApplicationFiled: December 28, 2020Publication date: March 30, 2023Inventors: Hiroyuki Iwamoto, Osamu Munekata, Kaichi Tsuruta, Katsuji Nakamura, Shigeki Kondoh, Masato Tsuchiya
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Patent number: 11583959Abstract: A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2). 300?3As+Sb+Bi+Pb??(1) 0.1?{(3As+Sb)/(Bi+Pb)}×100?200??(2) In the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.Type: GrantFiled: January 31, 2020Date of Patent: February 21, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Osamu Munekata, Masato Shiratori
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Publication number: 20230039027Abstract: In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.Type: ApplicationFiled: March 19, 2021Publication date: February 9, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Naoto KAMEDA, Masato TSUCHIYA, Katsuji NAKAMURA, Osamu MUNEKATA, Kaichi TSURUTA
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Publication number: 20220258288Abstract: A solder alloy, a solder powder and the like, which suppresses change in a solder paste over time and has excellent wettability, a small temperature difference between the liquidus temperature and the solidus temperature, and excellent mechanical properties, and exhibits a high joint strength, are provided. The solder alloy has an alloy composition containing 0.55 to 0.75 mass % of Cu, 0.0350 to 0.0600 mass % of Ni, 0.0035 to 0.0200 mass % of Ge, and 25 to 300 mass ppm of As, at least either one of 0 to 3000 mass ppm of Sb, 0 to 10000 mass ppm of Bi, and 0 to 5100 mass ppm of Pb, and a balance of Sn, and satisfies Expressions (1) to (3) below. 275?2As+Sb+Bi+Pb??(1) 0.01?(2As+Sb)/(Bi+Pb)?10.00??(2) 10.83?Cu/Ni?18.57??(3) In Expressions (1) to (3) shown above, Cu, Ni, As, Sb, Bi, and Pb each represent an amount (mass ppm) in the alloy composition.Type: ApplicationFiled: January 31, 2020Publication date: August 18, 2022Inventors: Hiroyoshi KAWASAKI, Osamu MUNEKATA, Masato SHIRATORI
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Publication number: 20220250193Abstract: A solder alloy which suppresses the change in a solder paste over time, exhibits excellent wettability, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits high mechanical properties, as well as a solder powder and a solder joint are provided. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 25000 ppm by mass of Bi and 0 ppm by mass to 8000 ppm by mass of Pb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2), 300?3As+Bi+Pb??(1) 0<2.3×10?4×Bi+8.2×10?4×Pb?7??(2) in the formula (1) and the formula (2), As, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.Type: ApplicationFiled: January 31, 2020Publication date: August 11, 2022Inventors: Hiroyoshi KAWASAKI, Osamu MUNEKATA, Masato SHIRATORI
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Patent number: 11344976Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.Type: GrantFiled: November 21, 2018Date of Patent: May 31, 2022Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
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Publication number: 20220088722Abstract: A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2). 300?3As+Sb+Bi+Pb??(1) 0.1?{(3As+Sb)/(Bi+Pb)}×100?200??(2) In the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.Type: ApplicationFiled: January 31, 2020Publication date: March 24, 2022Inventors: Hiroyoshi KAWASAKI, Osamu MUNEKATA, Masato SHIRATORI
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Publication number: 20210308808Abstract: A solder alloy has an alloy composition of As: 25 mass ppm to 300 mass ppm, Bi: 0 mass ppm or more and 25000 mass ppm or less, and Pb: more than 0 mass ppm and 8000 mass ppm or less, with a balance being made up of Sn, the solder alloy satisfying Expression (1) and Expression (2) below, 275?2As+Bi+Pb ??(1) 0<2.3×10?4×Bi+8.2×10?4×Pb?7 ??(2) where in Expression (1) and Expression (2), As, Bi and Pb represent respectively contents (mass ppm) thereof in the alloy composition.Type: ApplicationFiled: May 27, 2019Publication date: October 7, 2021Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Osamu Munekata, Masato Shiratori
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Publication number: 20210245305Abstract: A solder alloy having an alloy composition including at least one of As: 25 to 300 mass ppm, Pb: more than 0 mass ppm and 5100 mass ppm or less, and Sb: more than 0 mass ppm and 3000 mass ppm or less, and moreover Bi: more than 0 mass ppm and 10000 mass ppm or less, as well as a balance including Sn, wherein expression (1) and expression (2) below are satisfied: 275?2As+Sb+Bi+Pb??(1) 0.01?(2As+Sb)/(Bi+Pb)?10.00??(2) where in the expression (1) and the expression (2), As, Sb, Bi, and Pb each represent a content (mass ppm) in the alloy composition.Type: ApplicationFiled: May 27, 2019Publication date: August 12, 2021Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Osamu Munekata, Masato Shiratori
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Publication number: 20200376607Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.Type: ApplicationFiled: November 21, 2018Publication date: December 3, 2020Applicant: SENJU METAL INDUSTRY CO., LTD.,Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
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Patent number: 10780531Abstract: A solder ball includes 0.1% by mass or more and 10% by mass or less of In and a remainder of Sn. The ball has a yellowness (b*) in an L*a*b* color system of 2.8 or more and 15.0 or less and a lightness (L*) of 60 or more and 100 or less. The ball further includes at least one element selected from a group of 0% by mass or more and 4% by mass or less of Ag, 0% by mass or more and 1.0% by mass or less of Cu, 0% to 3% by mass in total of Bi and/or Sb, and 0% to 0.1% by mass in total of an element selected from a group of Ni, Co, Fe, Ge, and P, excluding a solder ball including 3% by mass of Ag, 0.5% by mass of Cu, 0.2% by mass of In and a remainder of Sn.Type: GrantFiled: November 7, 2019Date of Patent: September 22, 2020Assignee: Senju Metal Industry Co., Ltd.Inventors: Hiroyoshi Kawasaki, Yuri Nakamura, Osamu Munekata, Kaichi Tsuruta
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Publication number: 20200147732Abstract: A solder ball includes 0.1% by mass or more and 10% by mass or less of In and a remainder of Sn. The ball has a yellowness (b*) in an L*a*b* color system of 2.8 or more and 15.0 or less and a lightness (L*) of 60 or more and 100 or less. The ball further includes at least one element selected from a group of 0% by mass or more and 4% by mass or less of Ag, 0% by mass or more and 1.0% by mass or less of Cu, 0% to 3% by mass in total of Bi and/or Sb, and 0% to 0.1% by mass in total of an element selected from a group of Ni, Co, Fe, Ge, and P, excluding a solder ball including 3% by mass of Ag, 0.5% by mass of Cu, 0.2% by mass of In and a remainder of Sn.Type: ApplicationFiled: November 7, 2019Publication date: May 14, 2020Inventors: Hiroyoshi Kawasaki, Yuri Nakamura, Osamu Munekata, Kaichi Tsuruta
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Publication number: 20190358751Abstract: A solder alloy for joining a Cu pipe and/or a Fe pipe has an alloy composition comprising in mass %: Sb: 5.0% to 15.0%; Cu: 0.5% to 8.0%; Ni: 0.025% to 0.7%; and Co: 0.025% to 0.3%, with a balance being Sn. The alloy composition satisfies the relationship of 0.07?Co/Ni?6, where Co and Ni represent contents of Co and Ni in mass %, respectively.Type: ApplicationFiled: June 7, 2018Publication date: November 28, 2019Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Naoto KAMEDA, Osamu MUNEKATA, Kaichi TSURUTA, Isamu SATO
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Publication number: 20170348805Abstract: The disclosed solder alloy is useful for plating and for use with electronic components, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass % inclusive and the remainder including Sn, and is used in electrical contacts that are electrically connected through mechanical joining.Type: ApplicationFiled: December 9, 2015Publication date: December 7, 2017Applicants: SENJU METAL INDUSTRY CO., LTD., DDK Ltd.Inventors: Kaichi TSURUTA, Osamu MUNEKATA, Hiroyuki IWAMOTO, Atsushi IKEDA, Hiroyuki MORIUCHI, Shinichi KAYAMA, Yoshihiro TADOKORO
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Patent number: 8216395Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.Type: GrantFiled: March 22, 2010Date of Patent: July 10, 2012Assignee: Senju Metal Industry Co., Ltd.Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
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Publication number: 20100297470Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.Type: ApplicationFiled: March 22, 2010Publication date: November 25, 2010Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
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Patent number: 7682468Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.Type: GrantFiled: August 10, 2007Date of Patent: March 23, 2010Assignee: Senju Metal Industry Co., Ltd.Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
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Patent number: 7628308Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.Type: GrantFiled: January 8, 2003Date of Patent: December 8, 2009Assignees: Senju Metal Industry Co., Ltd., Matushita Electric Industrial Co., Ltd.Inventors: Masayuki Ojima, Haruo Suzuki, Hirofumi Nogami, Norihisa Eguchi, Osamu Munekata, Minoru Ueshima
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Publication number: 20080061117Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.Type: ApplicationFiled: August 10, 2007Publication date: March 13, 2008Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima