Abstract: The invention relates to a heatcurable dielectric resin composition for preparing a flexible heatcurable dielectric resin film having an uncured state, the resin film comprising an epoxy resin A having a solid state at normal temperature and an epoxy resin B having a viscosity of 10 Pa·s or less at 25° C. in a ratio (A:B) by weight of 25:75 to 75:25, and further comprising a dielectric ceramics in an amount of 20 to 80 volt based on the total amount of the epoxy resins A and B.

Abstract: The present invention provides a photosensitive resin composition which can provide a printing plate material having superior image remaining property and printing durability, which can be subjected to alkaline development. The present invention relates to a photosensitive resin composition comprising an ethylenically unsaturated compound, an alkali-soluble resin, a near-infrared-absorbing dye, a halomethyl group-containing compound and an organo boron anion-containing compound, wherein said alkali-soluble resin has carboxyl groups as a side chain, at least one of which is reacted with an epoxy group-containing ethylenically unsaturated compound to introduce an ethylenically unsaturated group, said organo boron anion-containing compound is a compound represented by a certain chemical formula (a), and wherein weight ratio of said ethylenically unsaturated compound: said alkali-soluble resin is from 40:60 to 90:10.

Abstract: The present invention provides a photosensitive resin composition having improved stability in a bright room, which can provide a printing plate material having superior image remaining property and printing durability, which can be subjected to alkaline development. Accordingly, the present invention relates to a photosensitive resin composition comprising an ethylenically unsaturated compound, an alkali-soluble resin, a near-infrared-absorbing dye, a halomethyl group-containing compound, a nitroxyl compound and an organo boron anion-containing compound, and a printing plate material comprising a substrate and a photosensitive layer formed by applying the photosensitive resin composition on the substrate.

Abstract: A photosolder resist composition of the invention is characterized by containing (A) a resin containing radical polymerization groups and carboxyl groups obtained by adding a cyclic ether group of a cyclic ether group-containing vinyl monomer to a carboxylic group of a radical copolymer containing at least isobornyl (meth) acrylate and a carboxyl group-containing vinyl monomer as monomer units; (B) an inorganic filler; and (C) a photocurable mixture of a polyfunctional acrylic monomer (c1), a cyclic ether group-containing compound (c2), and a photopolymerization initiator (c3).

Abstract: A photosolder resist composition is characterized by containing (A) a resin containing radical polymerization groups and carboxyl groups obtained by adding a cyclic ether group of a cyclic ether group-containing vinyl monomer to a carboxylic group of a radical copolymer containing at least a vinyl aromatic compound and a carboxyl group-containing vinyl monomer as monomer units; (B) an inorganic filler; (C) a photocurable mixture composed of a polyfunctional acrylic monomer (c1), a cyclic ether group-containing compound (c2) and a photopolymerization initiator (c3).

Abstract: A photosolder resist composition of the invention is characterized by containing (A) a resin containing radical polymerization groups and carboxyl groups obtained by adding a cyclic ether group of a cyclic ether group-containing vinyl monomer to a carboxylic group of a radical copolymer containing at least isobornyl (meth) acrylate and a carboxyl group-containing vinyl monomer as monomer units; (B) an inorganic filler; and (C) a photocurable mixture of a polyfunctional acrylic monomer (c1), a cyclic ether group-containing compound (c2), and a photopolymerization initiator (c3).

Abstract: Disclosed are aqueous photosolder resist compositions containing (A) an aqueous solution prepared by neutralizing a resin containing a free-radically polymerizable group and a carboxyl group with a base; (B) an inorganic filler; (C) a photocurable mixture of (c-1) a multifunctional acrylic monomer, (c-2) a compound having a cyclic ether group other than a glycidyl group and (c-3) a photoinitiator; and optionally (D) an aqueous solution prepared by neutralizing a frege-radically polymerized substance having an acid value of 130-230 mgKOH/mg. The cyclic ether group other than a glycidyl group is an alicyclic epoxy or oxetane group, for example.