Abstract: A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing a solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that a lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.

Abstract: After photographing a surface on which an ABS is formed, and the outer shape of a slider, the ABS and an engraved region formed within the ABS are identified from a photographed image. A reference that becomes a guide for attaching to a suspension is then computed, and a positional relationship between the reference and the outer shape of the slider is stored as association information. Next, the outer shape of the slider is measured, and measured values are compared to the association information and a reference is read out when attaching the slider to the suspension. An adhesive is discharged, from below, onto a suspension attachment surface of the slider based on the reference. The slider may then be attached to the suspension while holding the slider in a state where the ABS is positioned on an upper side of the slider.

Abstract: A limit switch 6 is placed on an end portion of the trip rod 4, which converts the mechanical deviation of the trip rod 4 into an electrical signal. The electrical signal from the limit switch 6 is transmitted to quick acting solenoid valves placed in a drive unit for a steam valve via a sequence circuit device, and then the steam valve is closed. Accordingly, an equipment structure can be simplified and reliability can be improved as compared to conventional arts.

Abstract: A steam valve is provided with a valve body, a valve seat, and a valve rod provided for the valve body. The valve body has a bottom portion to which a recessed portion is formed, and the recessed portion has an edge, which is positioned on an upstream side of a place at which a shock wave is generated in steam flowing through a steam path defined by the valve body and the valve seat.

Abstract: A nozzle unit for use in an adjoining apparatus which places a heat fused electrically conductive member in an adjoining position for adjoining a first member and a second member, thereby electrically adjoining the first member and the second member, the nozzle unit including: a tubular nozzle assembly having a containing space which contains the conductive member and an aperture which communicates with the containing space, through which the conductive member, contained in the containing space, is ejected to the adjoining position, and which has a diameter larger than a diameter of the conductive member; and a hold member for releasably holding the conductive member in the containing space; wherein the nozzle assembly includes a tubular guide area of an internal diameter same as the diameter of the aperture, in a region from the position of the conductive member, supported by the support member, to the aperture.

Abstract: A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.

Abstract: A limit switch 6 is placed on an end portion of the trip rod 4, which converts the mechanical deviation of the trip rod 4 into an electrical signal. The electrical signal from the limit switch 6 is transmitted to quick acting solenoid valves placed in a drive unit for a steam valve via a sequence circuit device, and then the steam valve is closed. Accordingly, an equipment structure can be simplified and reliability can be improved as compared to conventional arts.

Abstract: A limit switch 6 is placed on an end portion of the trip rod 4, which converts the mechanical deviation of the trip rod 4 into an electrical signal. The electrical signal from the limit switch 6 is transmitted to quick acting solenoid valves placed in a drive unit for a steam valve via a sequence circuit device, and then the steam valve is closed. Accordingly, an equipment structure can be simplified and reliability can be improved as compared to conventional arts.

Abstract: Provided is a method for adjusting static attitude of a magnetic head attached to a flexure that is disposed near a free end of a head support. The free end is a distal end in a longitudinal direction of the head support. The method includes generating an adjustment condition by analyzing an image signal obtained from images of the magnetic head, the images being picked up with at least two image pickup units; bending the flexure for static attitude adjustment based on the adjustment condition; and irradiating a laser beam to a bent area of the flexure.

Abstract: A limit switch 6 is placed on an end portion of the trip rod 4, which converts the mechanical deviation of the trip rod 4 into an electrical signal. The electrical signal from the limit switch 6 is transmitted to quick acting solenoid valves placed in a drive unit for a steam valve via a sequence circuit device, and then the steam valve is closed. Accordingly, an equipment structure can be simplified and reliability can be improved as compared to conventional arts.

Abstract: Provided is a method for adjusting static attitude of a thin film magnetic head attached to a flexure of a head arm assembly. The method includes: previously ranking and memorizing adjustment conditions corresponding to static attitude angles of the thin film magnetic head; measuring a static attitude angle of the thin film magnetic head; bending the flexure for static attitude adjustment based on a particular adjustment condition corresponding to a measured angle; and irradiating a laser beam to a bent area of the flexure.

Abstract: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

Abstract: A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing the above-mentioned solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that the above-mentioned lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.

Abstract: Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.

Abstract: The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.

Abstract: The present invention provides a bonding apparatus in which solder is conveyed onto a predetermined electrode, and the solder is melted by irradiation of a laser beam and is bonded to the electrode and has an object to prevent the solder from adhering to a solder conveying system of the apparatus. To achieve the above object, in the bonding apparatus, a film having low wettability to the solder and having a predetermined thickness such as a DLC film is coated on a region and a neighborhood of a solder holding and conveying member, which is contacted with the solder.

Abstract: A main steam valve with improved flow characteristic and enhanced reliability comprises a valve seat, a main valve body, and a bypass valve body. A side surface of the bypass valve body slidably fits into the inner surface of the main valve body and forms a steam inlet comprised of a plurality of rows of inlet openings arranged along the side surface. The openings are diametrically symmetrically arranged in the bypass valve, and the positions of the openings in each of the rows are shifted from the positions of openings in the next row.

Abstract: A steam valve in accordance with the present invention is the steam valve that houses a first valve device 21 composed of a valve seat, a valve body, a valve rod, and a driving device, and a second valve device 22 composed of the valve seat, the valve body, the valve rod, and the driving device, combined with each other in the valve casing 23, and a closing portion 41 to block a part of a main steam flow flowing from outside to inside of a strainer is formed in the strainer 27 that is housed in the valve casing 23 and that surrounds the valve body 29 of the first valve device. According to the above described configuration, the steam valve that is aimed to further decrease a pressure loss can be provided by effectively controlling the steam flow in the strainer housed in the valve casing.

Abstract: A hydraulic pressure generating apparatus includes a hydraulic oil feed line for feeding hydraulic oil with high pressure from an oil tank to a hydraulic pressure control system of a generator by an oil feeding pump unit, a hydraulic oil return line for returning drain oil from the hydraulic pressure control system to the oil tank, and a circulation line for circulating and purifying the hydraulic oil of the oil tank by a circulating pump unit. In such apparatus, the hydraulic oil is flame resistant hydraulic oil which is hardly deteriorated by direct heating, and the flame resistant hydraulic oil is heated by a heater disposed in the oil tank.

Abstract: After photographing a surface on which an ABS is formed, and the outer shape of a slider, the ABS and an engraved region formed within the ABS are identified from a photographed image. A reference that becomes a guide for attaching to a suspension is then computed, and a positional relationship between the reference and the outer shape of the slider is stored as association information. Next, the outer shape of the slider is measured, and measured values are compared to the association information and a reference is read out when attaching the slider to the suspension. An adhesive is discharged, from below, onto a suspension attachment surface of the slider based on the reference. The slider may then be attached to the suspension while holding the slider in a state where the ABS is positioned on an upper side of the slider.