Patents by Inventor Osamu Tamada
Osamu Tamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9687886Abstract: A method and apparatus capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning. A substrate is held in a horizontal posture by a spin chuck and rotated about a vertical axis by a rotation motor, and when an outlet of the nozzle is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle has started to move, only one dried core is produced in the vicinity of the center of the substrate, and thus production of not less than two dried cores in the vicinity of the center of the substrate is prevented. The dried region is spread all over the surface of the substrate.Type: GrantFiled: April 15, 2015Date of Patent: June 27, 2017Assignee: SCREEN Holdings Co., Ltd.Inventors: Tomohiro Goto, Masakazu Sanada, Kazuhito Shigemori, Osamu Tamada, Shuichi Yasuda
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Publication number: 20150217335Abstract: A method and apparatus capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning. A substrate is held in a horizontal posture by a spin chuck and rotated about a vertical axis by a rotation motor, and when an outlet of the nozzle is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle has started to move, only one dried core is produced in the vicinity of the center of the substrate, and thus production of not less than two dried cores in the vicinity of the center of the substrate is prevented. The dried region is spread all over the surface of the substrate.Type: ApplicationFiled: April 15, 2015Publication date: August 6, 2015Inventors: Tomohiro GOTO, Masakazu SANADA, Kazuhito SHIGEMORI, Osamu TAMADA, Shuichi YASUDA
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Patent number: 9059221Abstract: A method capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning is provided. A substrate W is held in a horizontal posture by a spin chuck 10 and rotated about a vertical axis by a rotation motor 14, and when an outlet of the nozzle 20 is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle 20 has started to move, only one dried core is produced in the vicinity of the center of the substrate W, and thus production of not less than two dried cores in the vicinity of the center of the substrate W is prevented. The dried region is spread all over the surface of the substrate W.Type: GrantFiled: August 29, 2007Date of Patent: June 16, 2015Assignee: SCREEN Holdings Co., Ltd.Inventors: Tomohiro Goto, Masakazu Sanada, Kazuhito Shigemori, Osamu Tamada, Shuichi Yasuda
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Patent number: 8887610Abstract: A capstan device for taking up a braided wire in a braided wire manufacturing apparatus for braiding a plurality of wires to manufacture the braided wire. The capstan device includes a capstan roller having a tapered outer peripheral surface and provided with a flange portion on an end at a small diameter side thereof, and a guide member. The guide member has a first guide surface provided to be turned toward a large diameter side of the capstan roller in an axial direction of the capstan roller in a position on a larger diameter side than a portion having the smallest diameter in the tapered outer peripheral surface, and a second guide surface provided to be protruded from the first guide surface at an outer peripheral side of the tapered outer peripheral surface.Type: GrantFiled: January 12, 2012Date of Patent: November 18, 2014Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Eiji Kobayashi, Osamu Tamada
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Publication number: 20130214079Abstract: A capstan device for taking up a braided wire in a braided wire manufacturing apparatus for braiding a plurality of wires to manufacture the braided wire. The capstan device includes a capstan roller having a tapered outer peripheral surface and provided with a flange portion on an end at a small diameter side thereof, and a guide member. The guide member has a first guide surface provided to be turned toward a large diameter side of the capstan roller in an axial direction of the capstan roller in a position on a larger diameter side than a portion having the smallest diameter in the tapered outer peripheral surface, and a second guide surface provided to be protruded from the first guide surface at an outer peripheral side of the tapered outer peripheral surface.Type: ApplicationFiled: January 12, 2012Publication date: August 22, 2013Applicant: SUMITOMO WIRING SYSTEMS, LTD.Inventors: Eiji Kobayashi, Osamu Tamada
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Patent number: 8286576Abstract: A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.Type: GrantFiled: September 30, 2008Date of Patent: October 16, 2012Assignee: Sokudo Co., Ltd.Inventors: Osamu Tamada, Masakazu Sanada, Tadashi Miyagi
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Patent number: 7926439Abstract: A coating device includes a box-shaped processing chamber. Slits are respectively provided on four side surfaces of the processing chamber. A box-shaped housing is provided so as to surround the processing chamber. A space is formed between the processing chamber and the housing. A fan filter unit for forming downflow in the space is provided on the top of the housing. Air supplied to the fan filter unit is cleaned by the fan filter unit, and is supplied to the space. The air supplied to the space is supplied to the processing chamber through each of the slits in the processing chamber. This causes a twister-shaped air current to be generated within the processing chamber.Type: GrantFiled: July 26, 2007Date of Patent: April 19, 2011Assignee: Dainippon Screen Mfg Co., Ltd.Inventors: Masakazu Sanada, Osamu Tamada
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Publication number: 20100126532Abstract: A processing solution supply nozzle is moved relatively from one end to the opposite end of a semiconductor wafer having undergone a developing operation while discharging an anti-static processing solution in a discharge width equal to or greater than the width of the semiconductor wafer. The anti-static processing solution is thereby supplied onto the semiconductor wafer. The prevention of charging of the substrate avoids the occurrence of defects. The processing solution supplied almost uniformly on the entire surface of the substrate also avoids the occurrence of defects.Type: ApplicationFiled: January 27, 2010Publication date: May 27, 2010Applicant: DAINIPPON SCREEN MFG. CO., LTDInventors: Osamu TAMADA, Masakazu SANADA
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Publication number: 20090269936Abstract: A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.Type: ApplicationFiled: September 30, 2008Publication date: October 29, 2009Applicant: Sokudo Co., Ltd.Inventors: Osamu Tamada, Masakazu Sanada, Tadashi Miyagi
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Publication number: 20090070946Abstract: A cleaning processing part including an edge cleaning processing unit for cleaning an edge of a substrate is provided in an indexer block. An indexer robot provided in the indexer block transports an unprocessed substrate taken out of a cassette to the cleaning processing part before transporting the unprocessed substrate to an anti-reflection film processing block serving as a processor. The cleaning processing part cleans an edge and a back surface of a substrate.Type: ApplicationFiled: September 16, 2008Publication date: March 19, 2009Applicant: Sokudo Co., Ltd.Inventors: Osamu Tamada, Masakazu Sanada, Tadashi Miyagi, Shuichi Yasuda
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Patent number: 7341555Abstract: A method of performing treatment on a desired part of a cavity includes use of an endoscope having a guide wire, a therapeutic instrument and a therapeutic instrument elevator base capable of guiding the instrument to a desired position. The guide wire is inserted into an insertion channel of the endoscope and located in a desired position in the cavity. The instrument is moved from a position in the cavity to a position closer to the operation portion of the endoscope than to the distal end of the endoscope. While a guide wire fixing means at the distal end of the endoscope fixes the guide wire, the instrument is completely pulled out from the instrument channel of the endoscope.Type: GrantFiled: September 27, 2004Date of Patent: March 11, 2008Assignee: Olympus CorporationInventors: Takashi Ootawara, Akira Suzuki, Hiroaki Kubokawa, Hidenobu Kimura, Osamu Tamada, Mamoru Nakada, Masayuki Iwasaka
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Publication number: 20080053487Abstract: A method capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning is provided. A substrate W is held in a horizontal posture by a spin chuck 10 and rotated about a vertical axis by a rotation motor 14, and when an outlet of the nozzle 20 is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle 20 has started to move, only one dried core is produced in the vicinity of the center of the substrate W, and thus production of not less than two dried cores in the vicinity of the center of the substrate W is prevented. The dried region is spread all over the surface of the substrate W.Type: ApplicationFiled: August 29, 2007Publication date: March 6, 2008Inventors: Tomohiro Goto, Masakazu Sanada, Kazuhito Shigemori, Osamu Tamada, Shuichi Yasuda
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Publication number: 20080022928Abstract: A coating device includes a box-shaped processing chamber. Slits are respectively provided on four side surfaces of the processing chamber. A box-shaped housing is provided so as to surround the processing chamber. A space is formed between the processing chamber and the housing. A fan filter unit for forming downflow in the space is provided on the top of the housing. Air supplied to the fan filter unit is cleaned by the fan filter unit, and is supplied to the space. The air supplied to the space is supplied to the processing chamber through each of the slits in the processing chamber. This causes a twister-shaped air current to be generated within the processing chamber.Type: ApplicationFiled: July 26, 2007Publication date: January 31, 2008Inventors: Masakazu Sanada, Osamu Tamada
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Publication number: 20080008973Abstract: The invention provides a method capable of preventing the occurrence of collapse of resist pattern accompanied by size reduction in pattern dimensions can be prevented when processing a resist film having been exposed and formed on the surface of a substrate, and in which there is no fear that posterior processes are adversely affected. In the step of processing a resist film having been exposed and formed on the surface of a substrate, a developer mixed with a hydrophobizing agent is fed onto the resist film on the substrate surface; or before rinsing the resist film having been processed, a solvent containing a hydrophobic resin is fed onto the resist film on the substrate surface. Thus, a resist exposed surface is made to be hydrophobic before the rinsing, and thereafter rinsed and dried by spinning.Type: ApplicationFiled: July 10, 2007Publication date: January 10, 2008Inventors: Tomohiro GOTO, Masakazu SANADA, Osamu TAMADA
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Publication number: 20070183051Abstract: A substrate is first spin-coated with an antireflection film material is carried out to the substrate to form antireflection film on the substrate. Next, a mixed solvent of HMDS and xylene is supplied in a predetermined quantity to the upper surface of the antireflection film, and is spin-dried in this state. The mixed solvent effects surface modifying treatment to reduce a hydrogen bonding component of surface energy of the antireflection film. Subsequently, the substrate receives heat treatment. This completes formation of the antireflection film on the substrate. As a result, the antireflection film has increased adhesion energy in water with respect to resist film, without impairing essential characteristics of the antireflection film.Type: ApplicationFiled: February 1, 2007Publication date: August 9, 2007Inventors: Osamu Tamada, Masakazu Sanada, Tomohiro Goto
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Patent number: 7220227Abstract: An adapter for an endoscope of the present invention includes: a locking device for attaching and detaching that attaches and locks this adapter for an endoscope onto a predefined position on an endoscope control part; and a first treatment tool locking device that keeps a treatment tool at a first predefined position. Furthermore, at the first predefined position, a guidewire entry aperture of the treatment tool and an entry aperture of a forceps plug are separated in such a way as to face each other along substantially the same line.Type: GrantFiled: July 27, 2004Date of Patent: May 22, 2007Assignee: Olympus CorporationInventors: Isao Sasaki, Tsuyoshi Nakagawa, Yasushi Ohkoshi, Jin Ito, Kenichi Adachi, Hiroaki Kubokawa, Hidenobu Kimura, Osamu Tamada, Tae Mitsuya, Takashi Otawara
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Patent number: 7105074Abstract: A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.Type: GrantFiled: July 22, 2002Date of Patent: September 12, 2006Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Osamu Tamada, Tsuyoshi Mitsuhashi, Minobu Matsunaga, Katsushi Yoshioka, Kenji Sugimoto, Kaoru Aoki, Moritaka Yano, Satoshi Yamamoto, Masakazu Sanada, Takashi Nagao, Mitsumasa Kodama
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Patent number: 7087010Abstract: Guide wire fixing means is provided for an insertion portion of an endoscope, and a guide wire is releasably engaged when inserting/removing a therapeutic instrument running on the guide wire with a distal end portion of the guide wire inserted into a therapeutic instrument insertion channel of the endoscope being led out from a distal end opening portion of the channel.Type: GrantFiled: December 14, 2001Date of Patent: August 8, 2006Assignee: Olympus CorporationInventors: Takashi Ootawara, Akira Suzuki, Hiroaki Kubokawa, Hidenobu Kimura, Osamu Tamada, Mamoru Nakada, Masayuki Iwasaka
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Publication number: 20050205113Abstract: A processing solution supply nozzle is moved relatively from one end to the opposite end of a semiconductor wafer having undergone a developing operation while discharging an anti-static processing solution in a discharge width equal to or greater than the width of the semiconductor wafer. The anti-static processing solution is thereby supplied onto the semiconductor wafer. The prevention of charging of the substrate avoids the occurrence of defects. The processing solution supplied almost uniformly on the entire surface of the substrate also avoids the occurrence of defects.Type: ApplicationFiled: March 16, 2005Publication date: September 22, 2005Inventors: Osamu Tamada, Masakazu Sanada
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Publication number: 20050065399Abstract: An adapter for an endoscope of the present invention includes: a locking device for attaching and detaching that attaches and locks this adapter for an endoscope onto a predefined position on an endoscope control part; and a first treatment tool locking device that keeps a treatment tool at a first predefined position. Furthermore, at the first predefined position, a guidewire entry aperture of the treatment tool and an entry aperture of a forceps plug are separated in such a way as to face each other along substantially the same line.Type: ApplicationFiled: July 27, 2004Publication date: March 24, 2005Applicant: OLYMPUS CORPORATIONInventors: Isao Sasaki, Tsuyoshi Nakagawa, Yasushi Okoshi, Jin Ito, Kenichi Adachi, Hiroaki Kubokawa, Hidenobu Kimura, Osamu Tamada, Tae Mitsuya, Takashi Otawara