Patents by Inventor Osamu Watanabe

Osamu Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11135422
    Abstract: The present invention provides a bio-electrode that is excellent in conductivity and biocompatibility, is light-weight, can be manufactured at low cost, and can control significant reduction in conductivity even though the bio-electrode is soaked in water or dried. The present invention is accomplished by providing a conductive substrate and a living body contact layer formed on the conductive substrate, where the living body contact layer is a cured product of a bio-electrode composition including an (A) ionic material and a (B) resin other than the component (A), in which the component (A) has both a repeating unit “a” of a lithium salt, a sodium salt, a potassium salt, or an ammonium salt of sulfonamide including a partial structure represented by the following general formula (1) and a repeating unit “b” having a silicon atom, —R1—C(?O)—N?—SO2—Rf1M+(1).
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: October 5, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Motoaki Iwabuchi, Osamu Watanabe, Takayuki Fujiwara, Yasuyoshi Kuroda
  • Patent number: 11071485
    Abstract: The present invention provides a bio-electrode composition including a polymer compound having both an ionic repeating unit A and a (meth)acrylate repeating unit B, wherein the ionic repeating unit A is a repeating unit selected from the group consisting of sodium salt, potassium salt, and ammonium salt having either or both partial structures shown by the following general formulae (1-1) and (1-2), and the (meth)acrylate repeating unit B is a repeating unit shown by the following general formula (2). This can form a living body contact layer for a bio-electrode with excellent electric conductivity, biocompatibility, and light weight, which can be manufactured at low cost and does not cause large lowering of the electric conductivity even when it is wetted with water or dried.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 27, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Koji Hasegawa, Osamu Watanabe, Motoaki Iwabuchi
  • Patent number: 11069651
    Abstract: A method of mounting a die includes: preparing a die having a bump formation surface on which a plurality of bump electrodes are formed; disposing a vacuum suction tool having a suction surface above the die such that the suction surface faces toward the bump formation surface; sandwiching a porous sheet between the suction surface and the bump formation surface and suctioning the die by the vacuum suction tool; and mounting the die that has been suctioned by the vacuum suction tool in a bonding region of a substrate with an adhesive material interposed therebetween, the porous sheet having a thickness equal to or greater than the protrusion height of the bump electrodes on the bump formation surface. Stabilization and ease of maintenance of vacuum suction can thereby be improved.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: July 20, 2021
    Assignees: SHINKAWA LTD., VALQUA, LTD.
    Inventors: Osamu Watanabe, Tomonori Nakamura, Yoshihito Hagiwara, Yuji Kanai
  • Patent number: 11043085
    Abstract: A self-service point-of-sale terminal including a cover section having an inverted U-shape open in a front side and a bottom side, a casing that is movable with respect to the cover section and includes a lock configured to fix a relative position of the casing with respect to the cover section, and a coin and bill depositing and dispensing machine housed within the casing.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: June 22, 2021
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Osamu Watanabe, Keiichi Saito
  • Patent number: 11024596
    Abstract: [Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: June 1, 2021
    Assignee: SHINKAWA LTD.
    Inventors: Osamu Watanabe, Tomonori Nakamura, Toru Maeda, Satoru Nagai, Yuichiro Noguchi
  • Publication number: 20210007218
    Abstract: The conductive wiring material composition includes (A) a polymer compound having a repeating unit “a” which has a structure selected from an ammonium salt, a lithium salt, a sodium salt, a potassium salt and a silver salt of any of fluorosulfonic acid, fluorosulfonimide and fluorosulfonamide and (B) metal powder, wherein the component (B) is contained with an amount exceeding 50 parts by mass based on 100 parts by mass of a solid content of the conductive wiring material composition excluding the component (B).
    Type: Application
    Filed: July 1, 2020
    Publication date: January 7, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun HATAKEYAMA, Koji HASEGAWA, Osamu WATANABE
  • Publication number: 20210005570
    Abstract: [Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.
    Type: Application
    Filed: November 29, 2017
    Publication date: January 7, 2021
    Applicant: SHINKAWA LTD.
    Inventors: Osamu WATANABE, Tomonori NAKAMURA, Toru MAEDA, Satoru NAGAI, Yuichiro NOGUCHI
  • Patent number: 10864366
    Abstract: The present invention provides a bio-electrode composition including: a resin containing a urethane bond in a main chain and a silsesquioxane in a side chain; and an electro-conductive material, wherein the electro-conductive material is a polymer compound having one or more repeating units selected from fluorosulfonic acid salts shown by the following general formulae (1)-1 and (1)-2, sulfonimide salts shown by the following general formula (1)-3, and sulfonamide salts shown by the following general formula (1)-4. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light in weight, manufacturable at low cost, and free from large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition, and a method for manufacturing the bio-electrode.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: December 15, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Motoaki Iwabuchi, Osamu Watanabe, Keisuke Niida
  • Patent number: 10811247
    Abstract: A cleaning and drying method of a semiconductor substrate capable of suppressing collapse or breakdown of a pattern which occur at the time of drying a cleaning solution after cleaning the substrate and decomposition of a resin at a bottom of the pattern, and capable of removing the cleaning solution with good efficiency without using a specific device.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: October 20, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Ogihara, Osamu Watanabe, Takeshi Nagata, Naoki Kobayashi, Daisuke Kori
  • Publication number: 20200321311
    Abstract: A method of mounting a die includes: preparing a die having a bump formation surface on which a plurality of bump electrodes are formed; disposing a vacuum suction tool having a suction surface above the die such that the suction surface faces toward the bump formation surface; sandwiching a porous sheet between the suction surface and the bump formation surface and suctioning the die by the vacuum suction tool; and mounting the die that has been suctioned by the vacuum suction tool in a bonding region of a substrate with an adhesive material interposed therebetween, the porous sheet having a thickness equal to or greater than the protrusion height of the bump electrodes on the bump formation surface. Stabilization and ease of maintenance of vacuum suction can thereby be improved.
    Type: Application
    Filed: May 30, 2017
    Publication date: October 8, 2020
    Applicants: SHINKAWA LTD., VALQUA, LTD.
    Inventors: Osamu WATANABE, Tomonori NAKAMURA, Yoshihito HAGIWARA, Yuji KANAI
  • Publication number: 20200291548
    Abstract: A PTFE sheet in which PTFE fibers having a diameter of 1 ?m or less are spun, the PTFE sheet having a Gurley value in the range of 1 s/100 cc/in2 to 3 s/100 cc/in2 and a shrinkage factor in a direction orthogonal to a sheet winding direction of no more than 10% when heated to 300° C. The PTFE sheet makes a die adsorbable via a tool, which is for heating the die when the die is mounted on a mounting body, by being sandwiched between the die and the tool, and suppresses the adhesion, to an adsorption surface of the tool or to the die, of an adhesion member for fixing the die to the mounted body. Through this configuration, a PTFE sheet capable of stabilizing vacuum adsorption and improving maintainability and a method for mounting a die are provided.
    Type: Application
    Filed: November 28, 2018
    Publication date: September 17, 2020
    Applicants: SHINKAWA LTD., VALQUA, LTD.
    Inventors: Osamu WATANABE, Tomonori NAKAMURA, Yoshihito HAGIWARA, Yuji KANAI
  • Patent number: 10773527
    Abstract: A printer includes a main body having a first opening through which a roll of paper can be inserted for installation within the main body and a second opening through which a roll of paper can be inserted for installation within the main body, a first cover configured to open and close the first opening, a second cover configured to open and close the second opening, a printing head attached to the first cover and configured to print an image on paper supplied from the roll of paper, and a roller attached to the second cover and configured to convey the paper from the roll of paper installed within the main body to the printing head. The paper is conveyed by the roller and printing is performed by the printing head when both the first and second covers are closed.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: September 15, 2020
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventor: Osamu Watanabe
  • Publication number: 20200286854
    Abstract: Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.
    Type: Application
    Filed: September 14, 2018
    Publication date: September 10, 2020
    Applicant: SHINKAWA LTD.
    Inventors: Tomonori NAKAMURA, Toru MAEDA, Satoru NAGAI, Yoshihiro SAEKI, Osamu WATANABE
  • Publication number: 20200276437
    Abstract: The present invention provides a bio-electrode that is excellent in conductivity and biocompatibility, is light-weight, can be manufactured at low cost, and can control significant reduction in conductivity even though the bio-electrode is soaked in water or dried. The present invention is accomplished by providing a conductive substrate and a living body contact layer formed on the conductive substrate, where the living body contact layer is a cured product of a bio-electrode composition including an (A) ionic material and a (B) resin other than the component (A), in which the component (A) has both a repeating unit “a” of a lithium salt, a sodium salt, a potassium salt, or an ammonium salt of sulfonamide including a partial structure represented by the following general formula (1) and a repeating unit “b” having a silicon atom, —R1—C(?O)—N?—SO2—Rf1M+(1).
    Type: Application
    Filed: May 15, 2020
    Publication date: September 3, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun HATAKEYAMA, Motoaki IWABUCHI, Osamu WATANABE, Takayuki FUJIWARA, Yasuyoshi KURODA
  • Patent number: 10759938
    Abstract: The present invention provides a bio-electrode composition including: a resin containing a main chain having a urethane bond and two side chains each having a silicon-containing group; and an electro-conductive material, wherein the electro-conductive material is a polymer compound having one or more repeating units selected from fluorosulfonic acid salts shown by the following formulae (1)-1 and (1)-2, sulfonimide salts shown by the following formula (1)-3, and sulfonamide salts shown by the following formula (1)-4. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light in weight, manufacturable at low cost, and free from large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition, and a method for manufacturing the bio-electrode.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: September 1, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Osamu Watanabe, Motoaki Iwabuchi, Shiori Nonaka
  • Patent number: 10743788
    Abstract: The present invention provides a bio-electrode composition including: a resin containing a urethane bond in a main chain and a siloxane bond in a side chain; and an electro-conductive material, wherein the electro-conductive material is a polymer compound having one or more repeating units selected from fluorosulfonic acid salts shown by the following formulae (1)-1 and (1)-2, sulfonimide salts shown by the following formula (1)-3, and sulfonamide salts shown by the following formula (1)-4. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light in weight, manufacturable at low cost, and free from large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition, and a method for manufacturing the bio-electrode.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: August 18, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Osamu Watanabe, Motoaki Iwabuchi
  • Patent number: 10734132
    Abstract: The present invention provides a bio-electrode composition capable of forming a living body contact layer for a bio-electrode that is excellent in conductivity and biocompatibility, is light-weight, can be manufactured at low cost, and can control significant reduction in conductivity even though the bio-electrode is soaked in water or dried. The present invention is accomplished by a bio-electrode composition including an (A) ionic material and a (B) resin other than the component (A), in which the component (A) has both a repeating unit “a” of a sodium salt, a potassium salt, or an ammonium salt including a partial structure represented by the following general formula (1) and a repeating unit “b” having a silicon atom.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: August 4, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Osamu Watanabe, Takayuki Fujiwara, Motoaki Iwabuchi, Yasuyoshi Kuroda
  • Publication number: 20200243476
    Abstract: A bonding apparatus bonds a semiconductor die, which has a first mam surface provided with a bump electrode, to a substrate by means of thermo-compression, with a thermo-compression film being interposed therebetween. The bonding apparatus includes: an intermediate stage that has a die placing surface on which the semiconductor die is placed such that the die placing surface faces the first main surface; and a bonding tool which detachably holds a second main surface of the semiconductor die that is placed on the intermediate stage, the second main surface being on the reverse side of the first main surface. The intermediate stage has a push-up mechanism which applies, to the first main surface of the semiconductor die, a force for separating the semiconductor die therefrom in the normal direction of the die placing surface (in a Z-axis direction).
    Type: Application
    Filed: May 18, 2018
    Publication date: July 30, 2020
    Applicant: SHINKAWA LTD.
    Inventors: Tetsuya OTANI, Osamu WATANABE, Tomonori NAKAMURA
  • Patent number: 10726967
    Abstract: The present invention provides: a biological electrode composition formable a living body contact layer for a biological electrode which is excellent in conductivity and biocompatibility, as well as light in the weight thereof and producible at a low cost, and in addition, which does not cause a significant decrease in the conductivity thereof regardless of under a water-wet condition and a dry condition; a polymer compound which can be suitably used for the biological electrode composition; a polymerizable monomer suitable as a raw material of the polymer compound; a biological electrode having a living body contact layer formed of the biological electrode composition; and a method for producing the same; and wherein, the polymerizable monomer is represented by the following general formula (1).
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: July 28, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Osamu Watanabe, Motoaki Iwabuchi, Takayuki Fujiwara
  • Patent number: 10717804
    Abstract: The present invention provides a silicon-containing compound shown by the following formula (1): wherein R1, R2, R3, R4, R5, and R6 each independently represent a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms, a phenyl group, a 3,3,3-trifluoropropyl group, or a group shown by —(OSiR7R8)n—OSiR9R10R11; R7, R8, R9, R10, and R11 have the same meanings as R1 to R6; X represents a linear or branched alkylene group having 3 to 7 carbon atoms optionally having an ether group; and “n” is an integer in the range of 0 to 100. This provides a stretchable film that has excellent stretchability and strength, with the film surface having excellent repellency, and a method for forming the same; as well as a urethane resin used for the stretchable film; and a silicon-containing compound to be a material of the urethane resin.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: July 21, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Shiori Nonaka, Yuji Harada, Ryo Mitsui, Osamu Watanabe