Patents by Inventor Oscar Khaselev
Oscar Khaselev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240021565Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.Type: ApplicationFiled: September 19, 2023Publication date: January 18, 2024Inventors: Angelo GULINO, Bogdan BANKIEWICZ, Oscar KHASELEV, Anna LIFTON, Michael T. MARCZI, Girard SIDONE, Paul SALERNO, Paul J. KOEP
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Patent number: 11842974Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.Type: GrantFiled: May 11, 2018Date of Patent: December 12, 2023Assignee: Alpha Assembly Solutions Inc.Inventors: Angelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
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Patent number: 11699632Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: GrantFiled: January 20, 2021Date of Patent: July 11, 2023Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Publication number: 20220371089Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.Type: ApplicationFiled: September 24, 2020Publication date: November 24, 2022Inventors: Shamik GHOSHAL, Nirmalya Kumar CHAKI, Remya CHANDRAN, Manoharan VENODH, Bawa SINGH, Barun DAS, Niveditha NAGARAJAN, Rahul RAUT, Oscar KHASELEV, Ranjit PANDHER, Supriya DEVARAJAN, Anubhav RUSTOGI
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Publication number: 20220241852Abstract: A method of making a combined sinter-ready silver film and carrier (1) comprises the steps of: a) creating a carrier (2) comprising designed openings (5); b) casting a silver film layer (7) into the designed openings (5), for example casting a silver paste; and c) drying the carrier (2) and silver film layer (7) to form the combined sinter-ready silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define the designed openings (5). The backing layer (4) may be configured for sealing a bottom of the designed openings (5), wherein at the start of step b), a top of the designed openings (5) may be open for receiving the cast silver film layer (7).Type: ApplicationFiled: May 5, 2020Publication date: August 4, 2022Inventors: Oscar KHASELEV, Matthew James SIEBENHUHNER, Monnir BOUREGHDA, Mike MARCZI, Carl BILGRIEN
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Patent number: 11390054Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.Type: GrantFiled: July 13, 2020Date of Patent: July 19, 2022Assignee: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Publication number: 20220169905Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: October 4, 2021Publication date: June 2, 2022Applicant: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 11289447Abstract: A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, and sintering the substrate, die and clip package.Type: GrantFiled: December 16, 2015Date of Patent: March 29, 2022Assignees: Alpha Assembly Solutions, Inc., Advanced Packaging Center BVInventors: Oscar Khaselev, Eef Boschman
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Patent number: 11162007Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: March 1, 2019Date of Patent: November 2, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20210289680Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: ApplicationFiled: January 20, 2021Publication date: September 16, 2021Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Patent number: 10905041Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: GrantFiled: September 16, 2013Date of Patent: January 26, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Publication number: 20200338859Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.Type: ApplicationFiled: July 13, 2020Publication date: October 29, 2020Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Patent number: 10710336Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.Type: GrantFiled: August 29, 2014Date of Patent: July 14, 2020Assignee: Alpha Assembly Solutions Inc.Inventors: Oscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Publication number: 20200203304Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.Type: ApplicationFiled: May 11, 2018Publication date: June 25, 2020Inventors: Angelo GULINO, Bogdan BANKIEWICZ, Oscar KHASELEV, Anna LIFTON, Michael T. MARCZI, Girard SIDONE, Paul SALERNO, Paul J. KOEP
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Patent number: 10535628Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.Type: GrantFiled: November 2, 2011Date of Patent: January 14, 2020Assignee: Alpha Assembly Solutions Inc.Inventors: Oscar Khaselev, Bin Mo, Michael T. Marczi, Bawa Singh, Monnir Boureghda
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Patent number: 10465295Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, <1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent. The composition can also include a soluble compound containing at least one element which when dissolved has a higher standard electrode potential than a metal to be etched or a soluble compound containing a group IA element, and a soluble platinum group metal. An ink composition can include a group VA compound or a group IIIA compound in a solvent system formulated to be jettable on a surface at a drop volume of about 5 to about 10 picoliters and to achieve a final sheet resistance of less than about 20 ?/? of the surface upon activation.Type: GrantFiled: May 19, 2015Date of Patent: November 5, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Steven Prokopiak, Ellen S. Tormey, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Patent number: 10462908Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.Type: GrantFiled: February 22, 2017Date of Patent: October 29, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
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Publication number: 20190194517Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Patent number: 10259980Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.Type: GrantFiled: October 29, 2013Date of Patent: April 16, 2019Assignee: Alpha Assembly Solutions Inc.Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
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Publication number: 20180166415Abstract: A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, lead and sintering the substrate, die and clip package.Type: ApplicationFiled: December 16, 2015Publication date: June 14, 2018Inventors: Oscar Khaselev, Eef Boschman