Patents by Inventor Oscar Rivera Hernandez

Oscar Rivera Hernandez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular packaging with elevating screw
    Patent number: 9857397
    Abstract: Modular packaging includes a solid state relay and a function module, wherein the function module comprises a housing containing a printed circuit board and an elevating screw. The elevating screw comprises a first end with an external threading and a second end with an external threading, where the elevating screw may be selectively altered between a first position and a second position within the housing. Related embodiments are disclosed.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: January 2, 2018
    Assignee: Sensata Technologies, Inc.
    Inventors: Oscar Rivera Hernandez, Mariela Reynoso Castillo, Ismael Favela Duran
  • Modular Packaging with Elevating Screw
    Publication number: 20170295653
    Abstract: Modular packaging includes a solid state relay and a function module, wherein the function module comprises a housing containing a printed circuit board and an elevating screw. The elevating screw comprises a first end with an external threading and a second end with an external threading, where the elevating screw may be selectively altered between a first position and a second position within the housing. Related embodiments are disclosed.
    Type: Application
    Filed: April 7, 2016
    Publication date: October 12, 2017
    Inventors: Oscar Rivera Hernandez, Mariela Reynoso Castillo, Ismael Favela Duran
  • Solid state switching device with integral heatsink
    Patent number: 8472194
    Abstract: Solid state switching device having a heatsink, a solid state switching element in heat conductive relationship with the heatsink, and an enclosure having ventilation openings adjacent to the heatsink through which air can flow to remove heat from the heatsink. In some disclosed embodiments, the heatsink has fins and ducts aligned with ventilation openings in the enclosure for removing heat by radiation and convection. In others, the heatsink is a generally planar baseplate, with ventilation openings in a side wall of the enclosure next to the baseplate for removing heat from the device. Spacers project laterally from the devices and permit a plurality of the devices to mounted side-by-side with space between the devices through which air can flow.
    Type: Grant
    Filed: May 5, 2010
    Date of Patent: June 25, 2013
    Assignee: Custom Sensors & Technologies, Inc.
    Inventors: Oscar Rivera Hernandez, Oscar Montero Hernandez
  • Solid State Switching Device with Integral Heatsink
    Publication number: 20110273844
    Abstract: Solid state switching device having a heatsink, a solid state switching element in heat conductive relationship with the heatsink, and an enclosure having ventilation openings adjacent to the heatsink through which air can flow to remove heat from the heatsink. In some disclosed embodiments, the heatsink has fins and ducts aligned with ventilation openings in the enclosure for removing heat by radiation and convection. In others, the heatsink is a generally planar baseplate, with ventilation openings in a side wall of the enclosure next to the baseplate for removing heat from the device. Spacers project laterally from the devices and permit a plurality of the devices to mounted side-by-side with space between the devices through which air can flow.
    Type: Application
    Filed: May 5, 2010
    Publication date: November 10, 2011
    Inventors: Oscar Rivera Hernandez, Oscar Montero Hernandez