Abstract: A structure and method for handling and processing wafers in a face down configuration is disclosed. A robot insertion blade supports a wafer to be processed in a recess having conically sloping wafer holding surfaces which touch the wafer only at its outer periphery. Once positioned in the chamber, a set of three transfer finger with sloped contact surfaces supported from a "C" shaped support assembly raise the wafer adjacent to a susceptor bottom surface. A recess in the face of the susceptor covering a large portion of the wafer is evacuated, compared to process chamber pressure, and when the differential pressure between the processing chamber and the evacuated recess behind the wafer can support the wafer, the transfer finger supports are lower and rotated out from under the wafer and susceptor assembly. The susceptor with the wafer attached by vacuum is then lowered to a processing location in contact with shadow rings supported by the "C" shaped support assembly and opposite a gas distribution plate.

Abstract: Disclosed is a method for enabling the contents of a first chamber to be moved into a second chamber without exposing either chamber to elements making particulate-producing sliding contact. In one aspect of the invention, the method includes providing a carrier for a vertically spaced array of articles such as semiconductor wafers and having a clamping device for clampingly holding each of the articles; locating the carrier within the second chamber; opening the carrier by moving a first portion of the carrier upwardly from a second portion or,he carrier without producing sliding contact within the second chamber; and releasing the a clamping device without producing sliding contact within the second chamber, whereby the articles are accessible within the second chamber.