Patents by Inventor Ossi Ilari Syvänne

Ossi Ilari Syvänne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11167901
    Abstract: Resealable packages having a pressure sensitive adhesive (PSA) layer that is fully integrated into the packaging film and a removable portion easily accessed by a peel tab at the edge of the package, adjacent to a score. Removal of a portion of the package exposes the pressure sensitive adhesive layer and allows for access to the product in the package interior. The package is easily resealed by folding the exposed pressure sensitive adhesive layer to adhere to the outer surface of the package.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: November 9, 2021
    Assignee: Bemis Company, Inc.
    Inventors: Ossi Ilari Syvänne, Kalle Ilmari Nättinen