Abstract: An apparatus and method determines the location of wafer boat plate elements having a plurality of plate elements arranged substantially parallel to each other. At least three sensors are moved along travel paths perpendicular to the plate elements, wherein at least a first travel path is above, at least a second travel path is below the wafer boat and at third travel path is laterally spaced from the first or second travel paths above or below the wafer boat. During this movement the position of the sensors along a respective travel path is determined continuously, and it is determined, in which position a respective plate element enters the measuring area of a sensor and exits the same. A distance between a sensor and an edge of a plate element is measured and the location of a respective plate element is determined by means of the sensor signals.

Abstract: An apparatus and method determines the location of wafer boat plate elements having a plurality of plate elements arranged substantially parallel to each other. At least three sensors are moved along travel paths perpendicular to the plate elements, wherein at least a first travel path is above, at least a second travel path is below the wafer boat and at third travel path is laterally spaced from the first or second travel paths above or below the wafer boat. During this movement the position of the sensors along a respective travel path is determined continuously, and it is determined, in which position a respective plate element enters the measuring area of a sensor and exits the same. A distance between a sensor and an edge of a plate element is measured and the location of a respective plate element is determined by means of the sensor signals.

Abstract: A device for determining the position of a semiconductor substrate on a rotation device having a rotational axis, including a direction of rotation detecting unit for determining the rotational state of the rotation device, and also including at least one light source and at least one receiver which is photo-sensitive to the light from the light source, wherein at least one light beam emitted by the light source is directed toward the edge of the semiconductor substrate and passes said edge to at least a partial extent. The light of the light beam which has passed to at least a partial extent is then detected at least partially by the receiver.

Abstract: Determination of the actual position of the rotation axis of a transportation mechanism relative to a reference axis, in particular relative to gravity, is performed with at least one inclination sensor mounted to the transportation mechanism having at least one measurement axis, and comprises the measurement of the inclination of at least the one inclination sensor along the at least one measurement axis in a first rotation position of the transportation mechanism, and the measurement of the inclination of the at least one inclination sensor along the at least one measurement axis in a second rotation position. The actual position of the rotation axis of the transportation mechanism may be determined from the measurement values of the inclination sensor and the angular separation between the rotation positions. The process is suitable in particular for a process to align the rotation axis of a transportation mechanism and for a process for replacing a transportation mechanism.

Abstract: A device for determining the position of a semiconductor substrate on a rotation device having a rotational axis, including a direction of rotation detecting unit for determining the rotational state of the rotation device, and also including at least one light source and at least one receiver which is photo-sensitive to the light from the light source, wherein at least one light beam emitted by the light source is directed toward the edge of the semiconductor substrate and passes said edge to at least a partial extent.

Abstract: Determination of the actual position of the rotation axis of a transportation mechanism relative to a reference axis, in particular relative to gravity, is performed with at least one inclination sensor mounted to the transportation mechanism having at least one measurement axis, and comprises the measurement of the inclination of at least the one inclination sensor along the at least one measurement axis in a first rotation position of the transportation mechanism, and the measurement of the inclination of the at least one inclination sensor along the at least one measurement axis in a second rotation position. The actual position of the rotation axis of the transportation mechanism may be determined from the measurement values of the inclination sensor and the angular separation between the rotation positions. The process is suitable in particular for a process to align the rotation axis of a transportation mechanism and for a process for replacing a transportation mechanism.

Abstract: A device is provided for accommodating disk-shaped objects, preferably semiconductor wafers for a thermal treatment thereof. The device has a carrier with at least two recesses for respective objects, and at least one cover for covering at least one of the recesses. A handling apparatus is also provided and has at least one transport arm, at least one support arm, at least one support drive provided on the arm for supporting, via vacuum, at least one object that is to be handled, a device for determining the individual weight of an object, and a vacuum control device for altering the vacuum as a function of the individual weight of an object.

Abstract: The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate.

Abstract: A device for receiving plate-shaped objects, preferably semiconductor wafers, for the thermal treatment thereof, enabling the processing of wafers made of connecting semiconductors in a particularly simple manner. The inventive device offers high productivity and low risk of damage as a carrier has at least two recesses for respectively receiving an object. The recesses on the carrier can preferably be provided with covers. Preferably, support pins are provided for loading and unloading purposes. The carrier and the support pins can move in a vertical direction in relation to each other. A handling device for objects is also disclosed.

Abstract: The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate.