Abstract: A semiconductor component including a semiconductor substrate having a main electrode and a control electrode. The main electrode includes a groove in which is inserted a U-shaped insulation body. The control electrode is disposed in the groove and is insulated from the main electrode by the insulation body. A spring is provided in the groove between the control electrode and the insulation body and presses the control electrode against the semiconductor substrate. In this way, the control electrode is displaceable with respect to the insulation body in a direction perpendicular to the main surface of the semiconductor substrate.

Abstract: A method for fostering the germination of plant seeds or the cultivation of plant cuttings wherein light-emitting diodes are positioned closely proximate the plant seeds or plant cuttings and energized so as to emit irradiating light on the plant seeds or plant cuttings of a wavelength between 400 and 800 nm. The light-emitting diodes can be energized with continuous or intermittent, high frequency energy.

Abstract: In a method of making an encircling groove (8) on the edge of a semiconductor slice (5) of a power semiconductor component, first of all the edge is surface-ground and then the groove (8) is ground in one operation by means of a form-grinding wheel (3) correspondingly contoured on the edge. An especially high output is achieved with diamond grinding wheels of appropriate grain size and suitable bond.

Abstract: A method and apparatus for forming a groove in a semiconductor element with at least two junctions between regions of alternating opposite conduction types and different doping concentrations and with the semiconducting region enclosed between the junctions exhibiting a higher resistivity than either of the neighboring regions, the lateral surface of the element between the surface edges of the junctions being sloped by means of a groove cut by sand blasting.