Abstract: A method and apparatus for increasing the integrated circuit density in a semiconductor assembly. The assembly includes a flexible interposer substrate attached to an active surface and a back side of a first die, the interposer substrate wrapping around at least one side of the first die. The assembly also includes an array of discrete conductive elements connected to bond pads of the first die through conductive traces and exposed on an exterior surface of the interposer substrate for effecting an external electrical connection. The assembly may include a second die facing the first die and attached to the interposer substrate, the interposer substrate being wrapped around either the first or second die or, alternatively, being wrapped around both the first and second die.

Abstract: Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an interface member having a die section attached to the die and an array section, and a casing encapsulating at least a portion of the die. The die section has a plurality of contacts coupled to bond-pads on the die, and the array section has an array of ball-pads coupled to the contacts by interconnecting circuitry in the interface member. The array section is folded over and/or under the die section, and the array section is attached to a backside of the die and/or a surface of the casing.

Abstract: A stacked-die assembly and a method of manufacturing a stacked-die assembly having a plurality of microelectronic devices. In one embodiment, a stacked-die assembly can include a first die, a second die juxtaposed to the first die, and an interface substrate coupled to the first and second dies. The first die can have a first integrated circuit and a first terminal array coupled to the first integrated circuit, and the second die can have a second integrated circuit and a second terminal array coupled to the second integrated circuit. The interface substrate can comprise a body, a first contact array on the body that is electrically coupled to the first terminal array of the first die, a second contact array on the body that is electrically coupled to the second terminal array of the second die, and at least one ball-pad array on the body.

Abstract: A method and apparatus for increasing the integrated circuit density in a semiconductor assembly. The assembly includes a flexible interposer substrate attached to an active surface and a back side of a first die, the interposer substrate wrapping around at least one side of the first die. The assembly also includes an array of discrete conductive elements connected to bond pads of the first die through conductive traces and exposed on an exterior surface of the interposer substrate for effecting an external electrical connection. The assembly may include a second die facing the first die and attached to the interposer substrate, the interposer substrate being wrapped around either the first or second die or, alternatively, being wrapped around both the first and second die.

Abstract: Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an interface member having a die section attached to the die and an array section, and a casing encapsulating at least a portion of the die. The die section has a plurality of contacts coupled to bond-pads on the die, and the array section has an array of ball-pads coupled to the contacts by interconnecting circuitry in the interface member. The array section is folded over and/or under the die section, and the array section is attached to a backside of the die and/or a surface of the casing.