Abstract: Apparatus for housing circuit cards that comprises a cylindrical housing having an internal wall having a single diameter. First and second cylindrical heat sinks are provided that each comprise a sloped outer surface. The heat sinks are disposed such that the sloped outer surfaces face each other. First and second circuit cards are secured to distal edges of respective heat sinks, or pairs of circuit cards are secured to both edges of respective heat sinks. Each circuit card comprises at least one internal interface connector that is designed to mate with an internal interface connector of an adjacent circuit card. A cylindrical card lock is provided that has an outer surface that is designed to contact the internal wall of the housing and an inner surface that has a V-shaped cross section having oppositely sloped surfaces. The respective sloped surfaces of the card lock are designed to mate with the sloped outer surfaces of the respective heat sinks.

Abstract: A high-density electronics package (10) that houses a plurality of circuit cards (21,22,25,26), heat sinks (23,27) and circuit interconnections (33) in a single housing (12). The electronics package (10) uses conical shaped interfaces for locating and locking components, which greatly enhances the serviceability, thermal management and strength of the electronics package (10). Assembly is accomplished by using a selected conical angle on a first heat sink (23) that mates with a matching conical surface (13) on the housing (12). A second heat sink (27) has a conical angle (located in the opposite direction of the conical angle of the first heat sink) that mates with an identical angle on an expandable wedge ring (31) used for positioning purposes.