Patents by Inventor P. Jithendra Kumar Reddy

P. Jithendra Kumar Reddy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level spatial signature grouping using transfer learning
    Patent number: 11967060
    Abstract: A wafer map is classified using the machine learning based model and a signature on the wafer map. The machine learning based model uses transfer learning. The machine learning based model can be trained using images from various sources that are extracted and augmented and their features extracted. These extracted features can be classified into defects that occur during semiconductor manufacturing.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: April 23, 2024
    Assignee: KLA CORPORATION
    Inventors: Narayani Narasimhan, Alán Dávila, P. Jithendra Kumar Reddy, Ski Sim, Osamu Yamamoto
  • Wafer Level Spatial Signature Grouping Using Transfer Learning
    Publication number: 20220067911
    Abstract: A wafer map is classified using the machine learning based model and a signature on the wafer map. The machine learning based model uses transfer learning. The machine learning based model can be trained using images from various sources that are extracted and augmented and their features extracted. These extracted features can be classified into defects that occur during semiconductor manufacturing.
    Type: Application
    Filed: August 17, 2021
    Publication date: March 3, 2022
    Inventors: Narayani Narasimhan, Alán Dávila, P. Jithendra Kumar Reddy, Ski Sim, Osamu Yamamoto