Abstract: An LED luminaire assembly which allows for the easy and safe removal and replacement of the PSU and other internal components wherein the heat sink can be folded or pivoted aside to allow access to and removal of the PSU.

Abstract: Thermal management techniques and methods for various types of structures that require a thermal property, such as thermal conductivity and/or flame retardance, and have a surface in proximity to a source of thermal energy. Such a structure includes a substrate formed of a metallic material or a thermally conductive plastic material, and a white fluoropolymer layer directly on a surface of the substrate without a discrete adhesive layer therebetween. The white fluoropolymer layer defines an outermost surface of the structure, has a reflectivity of greater than 95%, and has a thickness sufficient to inhibit degradation of the thermal property of the structure resulting from impingement of the surface by the thermal energy.

Abstract: An LED luminaire assembly which allows for the easy and safe removal and replacement of the PSU and other internal components wherein the heat sink can be folded or pivoted aside to allow access to and removal of the PSU.

Abstract: A lamp assembly is provided having one or more features for protecting an electronics package that is positioned outside of the evacuated space of a bulb containing a light emitting device such as an HID or halogen burner capsule. For example, the bulb can be evacuated and hermetically sealed to minimize heat transfer from the light emitting device. One or more reflective surfaces can be provided to reflect radiant energy from the light emitting device away from the electronics package. One or more insulating components can be positioned between the electronics package and the light emitting device.